Software Engineering PhD Intern New 2027

Intel Corporation•Hillsboro, OR

1d•$149,598 - $149,602•Onsite

About The Position

Intel is seeking a highly motivated Software Research Intern (PhD) to join the TCAD Process Reliability Modeling team within Intel Foundry. This internship offers an opportunity to work on advanced computational software solutions supporting semiconductor technology development. The selected candidate will contribute to cutting-edge software applications and solution methodologies like chip-package interactions, thermal transport and thermal management, thin films development and patterning. The internship is designed for PhD students interested in applying software engineering and research expertise to solve complex engineering challenges while collaborating with multidisciplinary teams across Intel. The Intel Foundry Technology organization is focused on driving semiconductor process innovation and enabling future technology nodes. Within the LTD-TD TCAD team, engineers and researchers develop advanced simulation, modeling, and software solutions used to accelerate technology development. The team fosters a collaborative environment where software, mathematics, physics, and engineering intersect to solve challenging technical problems.

Requirements

Must be a full-time student pursuing a Ph.D. degree in Electrical Engineering, Material Science, Mechanical Engineering, Chemical Engineering or a semiconductor-related field.
Must have a minimum of a 3.0 GPA in college courses to date.
1+ year experience programming in C/C++/Python or equivalent.
Strong analytical, problem-solving, and software development skills.

Nice To Haves

Experience with using TCAD or atomistic simulation tools to study thermo-mechanical and chip/package interactions, thermal transport, thin film deposition processes, patterning, material chemical interactions or circuit performance.
Hands on experience development and/or using finite element or equivalent solvers for solutions of physical systems.
Experience with physics-based modeling, AI/machine learning methodologies for the analysis of solid mechanics, thermal management, reliability and manufacturing process of microprocessors devices.

Responsibilities

Design, develop, and optimize software solutions for engineering and research applications.
Develop simulations capabilities using numerical methods like finite element, level sets, or related techniques.
Develop modeling-based methodologies to solve device and interconnect process, module and reliability problems.
Establish criteria and methods to determine proper inputs and validate results.
Collaborate with software engineers, researchers, and domain experts to deliver scalable and maintainable solutions.
Document technical solutions and present findings to project stakeholders.