SOC Thermal Engineer

Apple

8h

About The Position

We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device’s thermal performance and participate in advanced IC packaging research and development. The Thermal Engineer will design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines.

Requirements

• Bachelor's degree required.

Nice To Haves

• Demonstrated leadership capabilities at the senior engineer level.
• Deep expertise in thermal design for silicon devices and packaging solutions.
• Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies.
• Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches.
• Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics.
• Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs.
• Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products
• Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk.
• Experience designing and executing experimental test setups and analyzing thermal data.

Responsibilities

• Design and validate cooling solutions for high-performance computing systems.
• Simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines.
• Participate in advanced IC packaging research and development.
• Optimize mobile device’s thermal performance.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior