SMT SOLDERER TECHNICIAN CLASS 3

DITEK CORPORATION•Largo, FL

2d•Onsite

About The Position

DITEK is seeking a SMT Soldering Technician with Class 3 certification (including BGA, QFN, QFP, LGA and 0201 packages) to join our dynamic team and support our manufacturing processes. If you are detail-oriented, have strong soldering skills, and enjoy working in a collaborative environment, we’d love to hear from you!

Requirements

Minimum of eight (8) years’ experience in the manufacturing and rework of Printed Circuit Assemblies and their associated processes preferred for complex assemblies.
A high school diploma, GED or equivalent experience is required.
IPC class 2 & 3 standard workmanship, fine pitch SMT soldering, and rework of complex components and assemblies.
Ability to understand verbal and written communications in English.
Capable of following written and verbal instructions in English.
Communicate effectively in English.
Computer skills required.
Demonstrate good hand and eye coordination.
Must be able to differentiate colors.
Assemble components to specifications.
Familiarity of tools, devices, equipment, and calibrated equipment.
Proficient in IPC class 2 & 3 standard workmanship.
Attention to detail with minimal supervision.
Experience in using hand and power tools.
Ability to perform all functions of the job classification without posing a direct threat to the health or safety of other individuals in the workplace.

Nice To Haves

Experienced in improving processes, performance, and troubleshooting assembly problems.
Ability to reason thru process development and support of new technologies.

Responsibilities

IPC Class 3 certified with extensive experience hand soldering, building, inspecting, and reworking electronic components.
Advanced SMT soldering expertise, including fine-pitch and micro-mini components, including BGA, QFN, QFP, LGA and 0201 packages.
Experienced with lead-free and leaded soldering processes, proper flux application, and thermal control.
Strong understanding of workmanship criteria, defect recognition, and process indicators.
Identification of cosmetic vs. functional defects.
Strong adherence of ESD compliance, documentation accuracy, and adherence ISO manufacturing procedures.
Evaluation of solder fillet geometry, wetting, voiding, and bridging.
Experience with magnification and inspection tools.
Comfortable working under microscopes for extended periods.
Component removal and replacement using hot-air rework stations, preheaters and micro-soldering tools.
Ability to follow detailed work instructions, drawings and BOM’s.
Interpret PCB layouts, schematics, and assembly parts.
Collaboration with Process Engineering, Quality Engineering and Manufacturing.
High attention to detail and repeatability.
Strong workmanship discipline for critical assembly.
Clear documentation and communication of non-conformances.