SiP Layout Design Engineer

Analog Devices•Wilmington, MA

8d•Onsite

About The Position

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. We are looking for an experienced and detail-oriented SiP layout design engineer with strong expertise in laminate and PCB layout design for advanced semiconductor packaging applications. This role will support the development of flip-chip packages, system-in-package products, and module-based solutions across multiple market segments.

Requirements

Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or a related technical field.
5+ years of hands-on experience in laminate, substrate, PCB, or advanced package layout design.
Strong understanding of laminate, substrate, and PCB layout principles, including routing, stack-up design, power/ground plane design, via design, impedance control, creepage/clearance, and manufacturability constraints.
Strong knowledge of package structures, including BGA, LGA, flip-chip, system-in-package, multi-die packages, and module-based products.
Proficiency in Cadence Allegro and CAD software.
Familiarity with signal integrity, power integrity, thermal, mechanical, and reliability considerations in layout design.
Ability to manage multiple projects, meet schedules, and deliver high-quality layout work with minimal supervision.
Strong analytical skills, attention to detail, and ability to identify and resolve complex layout-related issues.
Strong communication skills and ability to work effectively in cross-functional and global teams.

Responsibilities

Develop detailed laminate, substrate, interposer, and PCB layout designs for flip-chip packages, SiP products, and module-based semiconductor solutions.
Design and optimize routing, power and ground planes, via structures, escape routing, interconnect schemes, and substrate stack-ups to meet electrical, thermal, mechanical, and reliability requirements.
Work closely with IC design, package engineering, and product engineering teams to ensure layout designs meet product specifications and package requirements.
Perform design rule checks, layout verification, and design reviews to ensure compliance with package, substrate, PCB, and assembly design rules.
Support layout feasibility studies, floor planning, package architecture selection, and design trade-off analysis for new package concepts.
Generate and maintain layout databases, design documentation, fabrication drawings, stack-up drawings, and design review materials.
Manage multiple layout projects, develop realistic layout schedules, track progress, and communicate status, risks, and issues to cross-functional teams.