Silicon Photonics TD Process/Product Integration Engineer

Intel Corporation•Rio Rancho, NM

3d•$115,110 - $219,550•Onsite

About The Position

As a Silicon Photonics (SiP) Process or Product Integration Engineer, you will be part of Intel's SiP Process Development and Manufacturing (SPDM) team that is leading Intel's market transition and driving innovation for the next generation of optical interconnect products. You will play a critical role in the next generation of silicon photonics product roadmaps, fabrication process development, yield improvement roadmaps, and reliability qualifications.

Requirements

Masters or Ph.D. in Engineering (Chemical, Electrical, Materials, etc.) and/or Science discipline such as Materials Science, Physics, Optics/Photonics.
2+ years of experience in semiconductor and/or silicon photonics process technology.
2+ years of experience in advanced data analysis (using JMP, GAJT and/or SQL), statistical process control (SPC), and design of experiment (DOE) principles.

Nice To Haves

1+ years of experience in any of the following: Optics, Photonics, SiP, Lasers, or III/V compound.
1+ years of experience with process integration roles in silicon photonics or other semiconductor technologies.
Good time management skills, self-motivated, and have strong desire to succeed in a fast-paced and challenging environment.
Ability to learn quickly, be resourceful and have strong problem solving skills.

Responsibilities

A Process Integrator collaborates with Yield Analysis, Device and Defect Engineers, IPS (SiP Product Division) designers, and Process Engineers to ensure new processes and products are capable of meeting yield and reliability requirements at the time of PRQ.
Defines and establishes process flow, procedures, and required equipment to develop new devices or products.
Plans and conducts experiments to fully characterize the process throughout the development cycle.
Trains production/receiving engineers for transfer to high volume manufacturing.
A Product Integration Engineer (PIE) will act as a key technical leader and the primary fab contact for integrating one or more products from customer roadmaps into F11x's fabrication process.
You will be responsible for driving and managing yield optimization efforts, New Product Introduction (NPI) roadmaps, process development, and Test/SORT/Burn-in capacity/capability to deliver product qualification milestones throughout all phases of the product life cycle (PLC).
You will be highly engaged in cross-functional teams to solve technical problems and deliver product milestones; interfacing between IPS, F11x process engineering, finance, planning, wafer-level test, quality and reliability (QnR), and OSAT teams.