Silicon Packaging Engineering Manager

Intel Corporation•Santa Clara, CA

4d•$190,610 - $269,100•Onsite

About The Position

Intel Foundry is seeking a highly experienced IC Packaging Design Manager to lead the delivery of advanced packaging solutions within the Advanced Design and Customer Engineering (ADCE) organization. You will lead a team responsible for driving package design execution to ensure first-pass success across customer programs. In this role, you will act as a trusted technical partner to customers, enabling successful adoption of Intel's advanced packaging technologies (EMIB, Foveros, chiplet architectures). This position requires technical depth, and leadership across all aspects of advanced packaging design.

Requirements

Bachelor's degree in Electrical Engineering or STEM related field with 9+ years of relevant experience OR- Master's degree in Electrical Engineering or STEM related field with 6+ years of relevant experience OR- PhD in Electrical Engineering or STEM related field with 4+ years of relevant experience
Experience in IC Package, chiplet/SOC design, or heterogenous integration, with at least 3 years in a leadership role.
Proven experience in a leadership or management role, with a track record of successfully leading engineering teams and delivering complex projects within established timelines.
Experience in performance/manufacturability/yield aware design methodologies
Experience with design flows and methodologies (physical design, analysis, verification).
Experience working with IC Packaging EDA tools from Siemens and/or Cadence.

Nice To Haves

Experience with IC Packaging designs for HPC/AI class of products

Responsibilities

Lead and manage a group of IC Packaging Engineers, providing guidance, mentorship, and support to ensure the successful execution of projects.
Oversee the planning, scheduling, and execution of package design projects, ensuring that milestones and deadlines are met.
Foster a collaborative and innovative team environment, encouraging continuous learning and professional development.
Lead design groups, coordinating efforts across multiple teams to achieve project goals.
Serve as the primary package design technical lead and guide customers through end-to-end package design flow.
Drive the development of advanced packaging designs, ensuring compliance with industry standards and best practices.
Collaborate with cross-functional teams, including package architects, silicon and board design teams, design rule owners, electrical analysis engineers, and integration teams to define and implement design specifications.
Leverage extensive experience in advanced packaging designs to meet design KPIs.
Ensure products are designed and developed with high quality standards by overseeing design processes, risk management, and compliance throughout the product design lifecycle, working closely with cross-functional teams to identify and address potential quality issues before they arise.
Develop and maintain detailed project plans, including resource allocation, risk management, and progress tracking.
Coordinate with stakeholders to ensure alignment on project goals, deliverables, and timelines.
Conduct regular project reviews and provide status updates to senior management.
Identify and implement process improvements to enhance the efficiency and quality of package designs and development.
Stay current with industry trends and emerging technologies, incorporating new methodologies and tools into the design process.
Drive innovation in product design, exploring new approaches and techniques to achieve competitive advantages.