Signal Integrity & Power Integrity Principal Engineer

AlteraSan Jose, CA
$187,000 - $270,000Onsite

About The Position

About Altera At Altera™, our independence as the world’s largest pure‑play FPGA solutions provider gives us the focus, speed, and agility to innovate without compromise. With more than four decades of industry‑leading FPGA expertise, our singular mission is to deliver the programmable technologies that help customers differentiate, innovate, and scale across rapidly evolving markets like AI, cloud, networking, and edge. As an independent company, we move faster, invest deeper, and partner more closely—empowering our teams to drive breakthrough innovation and shape the future of the FPGA industry. About the Role We are seeking a highly experienced Signal Integrity & Power Integrity (SI/PI) Engineer with 15+ years of industry experience to lead the design, verification, and optimization of high‑speed interconnects across silicon, IC package, and board‑level architectures. Key Responsibilities Lead end‑to‑end signal and power integrity design for IC packages, validation platforms, and development kit hardware to achieve best‑in‑class electrical performance and reliability. Define and deploy best‑in‑class SI/PI simulation methodologies, leveraging advanced EDA tools and AI‑assisted techniques to improve accuracy, efficiency, and product quality. Perform detailed simulation, review, and trade‑off analysis of package and board designs to ensure scalable and robust electrical solutions. Diagnose and resolve complex system‑level SI/PI challenges spanning electrical, mechanical, thermal, and manufacturing constraints. Collaborate across silicon, package, and board design teams to define optimized electrical solutions that meet performance targets while minimizing product cost and maximizing customer competitiveness. Drive forward‑looking SI/PI technologies, including advanced and heterogeneous packaging solutions, to support and influence future product architectures. Salary Range The pay range below is for Bay Area California only. Actual salary may vary based on a number of factors including job location, job-related knowledge, skills, experiences, trainings, etc. We also offer incentive opportunities that reward employees based on individual and company performance. $187,000 - $270,000 USD We use artificial intelligence to screen, assess, or select applicants for the position. Applicants must be eligible for any required U.S. export authorizations. #MD-1

Requirements

  • Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, with a strong foundation in electromagnetics, circuit analysis, and signal processing.
  • 15+ years of hands‑on experience in Signal Integrity and Power Integrity engineering across silicon, package, and board‑level designs.
  • Deep expertise in high‑speed digital interfaces, SI/PI fundamentals, and power delivery network behavior.
  • Proficiency with industry‑standard simulation and modeling tools such as ANSYS HFSS, Synopsys HSPICE, Cadence Sigrity, Keysight ADS, or equivalent platforms.
  • Strong analytical skills to interpret, correlate, and validate simulation, design, and measurement data.
  • Proven ability to solve complex, multi‑domain SI/PI problems with a structured and methodical approach.
  • Hands‑on experience with silicon/package/board layout and design tools (e.g., Mentor Graphics, Cadence Allegro).

Nice To Haves

  • Scripting and automation experience using Python, MATLAB, or similar languages is highly desirable.
  • Master’s or PhD in Electrical Engineering, Computer Engineering, or a related field, with a strong foundation in electromagnetics, circuit analysis, and signal processing.

Responsibilities

  • Lead end‑to‑end signal and power integrity design for IC packages, validation platforms, and development kit hardware to achieve best‑in‑class electrical performance and reliability.
  • Define and deploy best‑in‑class SI/PI simulation methodologies, leveraging advanced EDA tools and AI‑assisted techniques to improve accuracy, efficiency, and product quality.
  • Perform detailed simulation, review, and trade‑off analysis of package and board designs to ensure scalable and robust electrical solutions.
  • Diagnose and resolve complex system‑level SI/PI challenges spanning electrical, mechanical, thermal, and manufacturing constraints.
  • Collaborate across silicon, package, and board design teams to define optimized electrical solutions that meet performance targets while minimizing product cost and maximizing customer competitiveness.
  • Drive forward‑looking SI/PI technologies, including advanced and heterogeneous packaging solutions, to support and influence future product architectures.
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