Signal Integrity Engineer - MTS

Micron • Boise, ID

7d • Onsite

About The Position

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Signal Integrity team, drives the high end high performance high speed product signaling and power designs for products like HBM, GDDR, LPDRAM, DDR5/DDR6, PCIeGen7 and sophisticated signaling development! We handle the Interconnect and signaling exploration and development to proactively engage in future performance scaling through sophisticated signaling techniques and package / channel improvement, including circuit power reduction, data encoding, channel equalization, new interconnect technologies, etc! Traditional interface standardization efforts through JEDEC and similar standards bodies and through close customer / partner engagements. Modeling and methodology improvement within the larger SI group and throughout Micron where applicable. Active mentoring of junior team members through informal one-on-one collaboration and through more formal department-level and corporate-level knowledge sharing opportunities. We are encouraged to engage across multiple disciplines and organizations (e.g., Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration and Product Engineering).

Requirements

• PhD with 5 years of industry experience or MSEE with 10 years of industry experience
• Strong Signal and Power Integrity Background
• Strong Mixed-signal Circuit Design Background
• Hands-on knowledge of 3D E.M. field solvers, Matlab, time and frequency domain simulation tools like HFSS, HSPICE, SPECTRE, ADS, etc.
• Solid understanding of lab measurement equipment such as Oscilloscopes, TDR, Vector Network Analyzer (VNA), etc.

Nice To Haves

• Pro-active – identify gaps and opportunities and address them with minimal direction.
• Transformational – think “outside-the-box” and yet offer innovative solutions within a set of practical constraints.
• Communicator – clearly convey vital details of sophisticated issues and corresponding solutions in both written and verbal formats.

Responsibilities

• Drives high-end, high-performance, high-speed product signaling and power designs for products like HBM, GDDR, LPDRAM, DDR5/DDR6, PCIeGen7.
• Handles interconnect and signaling exploration and development for future performance scaling.
• Focuses on sophisticated signaling techniques and package/channel improvement, including circuit power reduction, data encoding, and channel equalization.
• Engages in traditional interface standardization efforts through JEDEC and similar standards bodies.
• Collaborates closely with customers and partners.
• Improves modeling and methodology within the SI group and throughout Micron.
• Mentors junior team members through informal one-on-one collaboration and formal knowledge sharing opportunities.
• Engages across multiple disciplines and organizations, including Signal Integrity, Circuit and Chip Design, Packaging R&D, and System Integration and Product Engineering.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level