Signal and Power Integrity Technical Leader (Remote)
About The Position
We are seeking a highly qualified Signal and Power Integrity Technical Leader to help us develop our next generation ASIC packaging and lead our Silicon Packaging Signal and Power Integrity Team to define, design and verify ASIC packaging to be deployed in a range of Cisco platforms. Develop, document, and implement design rules for ultra-high-speed signaling, ensuring power, performance, and area goals are met for products. Analyze substrate signal integrity (SI) and power integrity (PI), providing feedback and collaborating with the layout team to develop optimal solutions across interposer, substrate, and PCB. Design, document, and develop ASIC packages for high-volume, high-quality release, including post-layout extraction and reporting. Collaborate with system partners, vendors, and design leads to achieve combined power and signal integrity and to resolve complex technical issues using advanced technology design rules. Define the processes, methods, and tools for the design and implementation of complex ASIC/package developments. Lead or participate in chip architecture discussions and the definition, architecture, and design of high-performance ASICs, including reviews of intricate IC and analog/mixed-signal circuit designs. Mentor and support the signal integrity team, junior engineers, and influence packaging/hardware teams, ensuring all technical specifications and innovative solutions are met. Develop and promote a culture of design reviews, postmortems, and continuous improvement across multi-disciplined engineering teams.
Requirements
- Bachelor's degree in Electrical Engineering and 10+ years of relevant signal and/or power integrity experience, or Master's degree in Electrical Engineering and 8+ years of relevant signal and/or power integrity experience, or PhD in Electrical Engineering and 5+ years of relevant signal and/or power integrity experience.
- Experience with multiple high-speed ASIC tape-outs from a package perspective.
- Experience with 56G PAM4 and above, high-speed SerDes architectures, channel modeling, BER prediction, transmission line theory, and electromagnetics with a solid understanding of scattering and impedance network parameters.
- Hands-on lab experience with Keysight ADS, Ansys HFSS/EM flow, and Cadence APD for layout review.
- Experience with SPICE.
Nice To Haves
- Experience leading small to medium technical teams.
- Skilled in articulating ideas and technical concepts to diverse audiences, both verbally and in writing.
- Experience with advanced nodes (5nm, 3nm and below).
- Experience with high-bandwidth memory (HBM) or high-speed memory interface SI.
- Experience with die-to-die interfaces (UCIe or proprietary).
- Experience with advanced packaging (CoWoS, EMIB, interposer-based designs), including SI/PI analysis of 2.5D ASIC packaging.
- Experience with MATLAB or Python scripting.
- Experience with Raptor-X.
- Experience with Vector Network Analysis.
- Experience with IBIS.
Responsibilities
- Develop, document, and implement design rules for ultra-high-speed signaling, ensuring power, performance, and area goals are met for products.
- Analyze substrate signal integrity (SI) and power integrity (PI), providing feedback and collaborating with the layout team to develop optimal solutions across interposer, substrate, and PCB.
- Design, document, and develop ASIC packages for high-volume, high-quality release, including post-layout extraction and reporting.
- Collaborate with system partners, vendors, and design leads to achieve combined power and signal integrity and to resolve complex technical issues using advanced technology design rules.
- Define the processes, methods, and tools for the design and implementation of complex ASIC/package developments.
- Lead or participate in chip architecture discussions and the definition, architecture, and design of high-performance ASICs, including reviews of intricate IC and analog/mixed-signal circuit designs.
- Mentor and support the signal integrity team, junior engineers, and influence packaging/hardware teams, ensuring all technical specifications and innovative solutions are met.
- Develop and promote a culture of design reviews, postmortems, and continuous improvement across multi-disciplined engineering teams.
Benefits
- medical, dental and vision insurance
- a 401(k) plan with a Cisco matching contribution
- paid parental leave
- short and long-term disability coverage
- basic life insurance
- grants of Cisco restricted stock units
- 10 paid holidays per full calendar year
- 1 floating holiday for non-exempt employees
- 1 paid day off for employee’s birthday
- paid year-end holiday shutdown
- 4 paid days off for personal wellness
- 16 days of paid vacation time per full calendar year (non-exempt employees)
- flexible vacation time off program (exempt employees)
- 80 hours of sick time off provided on hire date and each January 1st thereafter
- up to 80 hours of unused sick time carried forward from one calendar year to the next
- Additional paid time away may be requested to deal with critical or emergency issues for family members
- Optional 10 paid days per full calendar year to volunteer
- annual bonuses (for non-sales roles)
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What This Job Offers
Job Type
Full-time
Career Level
Senior
