Senior/Principal Power and Signal Integrity Engineer

Microsoft•Redmond, WA

6d•$119,800 - $304,200

About The Position

Microsoft Quantum is working to build scalable quantum computing systems through advances in quantum devices, cryogenic complementary metal-oxide-semiconductor (Cryo-CMOS) electronics, advanced packaging, system architecture, software, and cloud infrastructure. This work brings together disciplines across the computing stack to help scientists tackle problems that are beyond the reach of today’s computing platforms. We are seeking a Senior/Principal Power Signal Integrity Engineer to help define the electrical architecture of next-generation Cryo-CMOS quantum control systems. You will design and analyze power delivery, signal integrity, and electrical isolation strategies across silicon, package, and board-level implementations. In this role, you'll help solve one of the industry's hardest mixed-signal problems: getting large-scale digital control systems to work alongside extremely sensitive qubit control and measurement circuitry. This work draws on expertise in power delivery networks, mixed-signal integration, electromagnetic coupling, and silicon-package-board co-design. Microsoft’s mission is to empower every person and every organization on the planet to achieve more. As employees, we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.

Requirements

Doctorate in Physics, Engineering, or related field AND 1+ year(s) experience in industry or in a research and development environment, could include completion of a post doctoral research position OR Master's Degree in Physics, Engineering, or related field AND 4+ years experience in industry or in a research and development environment OR Bachelor's Degree in Physics, Engineering, or related field AND 6+ years experience in industry or in a research and development environment OR equivalent experience.
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role.
Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations (ITAR) or Export Administration Regulations (EAR), the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. § 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
Ability to leverage AI tools to drive innovation and efficiency (e.g., performance modeling and analysis, research gathering, day to day task automation).
Ability to work in an AI-first environment using modern AI tools to accelerate discovery through hardware development.

Nice To Haves

Doctorate in Physics, Engineering, or related field AND 3+ years experience in industry or in a research and development environment, could include completion of a post doctoral research position OR Master's Degree in Physics, Engineering, or related field AND 6+ years experience in industry or in a research and development environment OR Bachelor's Degree in Physics, Engineering, or related field AND 8+ years experience in industry or in a research and development environment OR equivalent experience.
Experience with power integrity and signal integrity for complex mixed-signal electronic systems, including power delivery network architecture, IR drop, voltage droop, simultaneous switching noise, ground bounce, return-current behavior, electromagnetic coupling, and transmission-line effects.
Experience designing and analyzing power delivery networks across application-specific integrated circuits (ASICs), semiconductor packages, printed circuit boards (PCBs), and complete electronic systems, including silicon-package-board co-analysis and design optimization.
Experience using industry-standard simulation tools such as Synopsys RaptorX, Ansys HFSS, SIwave, Cadence Clarity, PowerSI, Keysight ADS, Spectre, HSPICE, or equivalent environments.
Experience correlating simulation results with laboratory characterization and measurement data.
Experience designing large mixed-signal ASICs that integrate substantial digital content with sensitive analog, radio-frequency (RF), or precision measurement circuitry, including architectures requiring isolation between noise-generating and noise-sensitive systems.
Experience with advanced packaging technologies, including 2.5D and 3D integration, silicon interposers, chiplet architectures, and advanced package substrates.
Experience defining power integrity signoff methodologies and integrated silicon-package-board design flows.
Familiarity with Cryo-CMOS circuits, cryogenic electronics, quantum computing hardware, superconducting systems, or advanced instrumentation.
Experience leading cross-functional hardware programs and supporting the development of engineers across multiple disciplines.

Responsibilities

Define and drive power integrity and signal integrity strategy for next-generation Cryo-CMOS quantum control systems.
Own electrical integrity across silicon, package, PCB, interconnect, and system-level implementations.
Architect and optimize power delivery networks spanning on-chip power grids, advanced packages, and board-level power distribution.
Develop isolation strategies that enable large-scale digital switching circuitry to coexist with highly sensitive analog, RF, and qubit-control signals.
Lead analysis and mitigation of power delivery, switching noise, electromagnetic coupling, crosstalk, and mixed-signal interference mechanisms.
Drive silicon-package-board co-design activities in partnership with ASIC, package, board, system, and quantum hardware teams.
Establish design methodologies, validation plans, and signoff criteria for power integrity and signal integrity closure.
Correlate simulation results with laboratory measurements and provide technical leadership for critical architecture decisions across the organization.
Embody our culture and values.