Senior Technologist, Hybrid Bonding Module

Intel Corporation•Hillsboro, OR

11d•$180,770 - $255,200•Onsite

About The Position

As a Senior Technologist for Die-to-Wafer Hybrid Bonding (HBI), you will drive process and equipment development for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments. Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap.

Requirements

Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 9+ years of experience; OR Master's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 6+ years of experience; OR PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 4+ years of experience.
5+ years of industry experience in hybrid bonding, wafer bonding, advanced packaging, or closely related semiconductor manufacturing technologies.
Demonstrated ability to solve complex technical problems using structured engineering methodologies.
Strong written and verbal communication skills with the ability to present technical findings to diverse audiences.
Ability to influence and collaborate across cross-functional teams in technology development and manufacturing environments.
Proven ability to mentor and develop engineers and technical team members.
Demonstrated ability to manage multiple priorities and drive results in a fast-paced environment.

Nice To Haves

Experience leading first-of-a-kind (FOK) process or equipment development programs.
Experience introducing new hybrid bonding platforms, manufacturing capabilities, or advanced packaging technologies.
Knowledge of bond interface defect mechanisms, including void formation, adhesion challenges, contamination effects, and material interactions.
Experience with alignment-sensitive manufacturing processes and overlay performance optimization.
Experience with process characterization, metrology, defect inspection, or failure analysis techniques.
Experience improving equipment capability, throughput, utilization, or process performance in a manufacturing environment.
Experience collaborating with external equipment suppliers and materials vendors on technology development activities.
Experience supporting technology transfer from development to manufacturing.

Responsibilities

Drive process and/or equipment development for die-to-wafer hybrid bonding, including material selection, parameter optimization, equipment characterization, and process control.
Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance.
Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.
Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies.
Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies.
Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and output.
Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies.
Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions.
Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement.
Contribute to future technology roadmaps through evaluation of emerging hybrid bonding technologies.