About The Position

This position is contingent upon contract award. The Senior Radio Frequency Engineer will lead High Power Amplifier Circuit Card Assembly redesign to achieve strict Form‑Fit‑Function‑Interface compatibility. Responsibilities include planning and executing measurements of GFP/GFI hardware, deriving and verifying baseline parameters, developing correlated RF and thermal simulation models, and evaluating device topologies. The role also involves authoring and maintaining requirements in MBSE, producing SSS and ICS with full traceability, owning EMI/EMC and environmental planning, and preparing for SRR/PDR with Government stakeholders. Additionally, the engineer will coordinate U.S. vendor market surveys, manage NDAs, integrate supplier inputs, collaborate with program management on PMP and IMS, and mentor team members.

Requirements

  • Bachelor’s Degree in relevant engineering or science discipline required
  • 8+ years experience designing, testing, and qualifying RF power amplifiers for radar or high‑power pulsed applications (L‑band preferred)
  • Hands‑on experience with BJT/LDMOS/GaN device selection, biasing, matching networks, and microstrip layout
  • Proficiency building high‑fidelity RF and thermal models (e.g., Ansys HFSS/Icepak) and correlating to measured data
  • Requirements engineering using MBSE tools (e.g., Cameo)
  • Authoring System/Subsystem Specifications and Interface Control Specifications
  • EMI/EMC planning and pre‑qualification per MIL‑STD‑461; environmental and ESS testing per MIL‑STD‑810
  • Must be a US citizen
  • If selected candidate does not have an active Clearance at level Secret or higher, one will be obtained upon hire

Nice To Haves

  • Master’s degree preferred

Responsibilities

  • Lead High Power Amplifier Circuit Card Assembly redesign to achieve strict Form‑Fit‑Function‑Interface compatibility
  • Plan and execute measurements of GFP/GFI hardware; derive and verify baseline parameters (gain/flatness, impedance/VSWR, output power, spectral purity, pulse shape/timing)
  • Develop correlated RF and thermal simulation models; evaluate device topologies (BJT/LDMOS/GaN) and output combining networks
  • Author and maintain requirements in MBSE; produce SSS and ICS with full traceability to sources and verification methods
  • Own EMI/EMC and environmental planning; define fixtures and pre‑qualification per applicable standards
  • Prepare and lead SRR/PDR with Government stakeholders; capture minutes, actions, and update RAID log
  • Coordinate U.S. vendor market survey; manage NDAs; integrate supplier inputs on risks, manufacturability, and prototype ROM
  • Collaborate with program management to maintain PMP and IMS; report status, risks, and mitigations
  • Mentor team members; uphold engineering rigor and documentation quality
  • Other duties as assigned

Benefits

  • Health Care Plan (Medical, Dental & Vision)
  • Retirement Plan (401k, IRA)
  • Life Insurance (Basic, Voluntary & AD&D)
  • Paid Time Off (Vacation, Sick & Public Holidays)
  • Short Term & Long Term Disability
  • Training & Development
  • Wellness Resources
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