This position is contingent upon contract award. The Senior Radio Frequency Engineer will lead High Power Amplifier Circuit Card Assembly redesign to achieve strict Form‑Fit‑Function‑Interface compatibility. Responsibilities include planning and executing measurements of GFP/GFI hardware, deriving and verifying baseline parameters, developing correlated RF and thermal simulation models, and evaluating device topologies. The role also involves authoring and maintaining requirements in MBSE, producing SSS and ICS with full traceability, owning EMI/EMC and environmental planning, and preparing for SRR/PDR with Government stakeholders. Additionally, the engineer will coordinate U.S. vendor market surveys, manage NDAs, integrate supplier inputs, collaborate with program management on PMP and IMS, and mentor team members.
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Job Type
Full-time
Career Level
Senior