Senior Project Manager for Chip-to-Package Interaction (CPI) Qualifications

GlobalFoundriesMalta, NY
$98,000 - $176,000Onsite

About The Position

To further strengthen our Chip-to-Package Interaction (CPI) team, we are seeking an experienced and highly motivated Senior Qualification Project Manager with a strong background in semiconductor technology development, project management, post-fab technologies (bumping, assembly, and package-level testing), BEOL integration fundamentals, and reliability qualification methodologies. In this role, you will lead CPI qualification programs from concept through qualification and technology release, working closely with global, cross-functional teams including technology development, design, reliability engineering, manufacturing, and external assembly and test partners (OSATs). You will play a key role in enabling next-generation semiconductor packaging solutions and advanced technology platforms. The position is based at GlobalFoundries' facility in Malta, New York.

Requirements

  • Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or a related technical discipline.
  • Minimum of 5 years of experience in the semiconductor industry, with a background in technology development, packaging, assembly, reliability engineering, qualification, or related areas.
  • Proven success leading complex, cross-functional technical projects from concept through qualification and technology release.
  • Strong knowledge of semiconductor packaging and post-fab technologies, including bumping, assembly, package-level testing, and OSAT operations.
  • Solid understanding of BEOL process integration, chip-to-package interactions, and semiconductor reliability qualification methodologies.
  • Experience defining qualification plans, test structures, characterization requirements, and technology readiness assessments.
  • Demonstrated project management experience, including schedule, budget, resource, and risk management.
  • Strong leadership, communication, and stakeholder management skills, with the ability to effectively influence and coordinate global teams and external partners.
  • Excellent analytical and problem-solving skills, with the ability to manage multiple priorities in a dynamic technology development environment.

Nice To Haves

  • Experience with packaging technologies such as wirebond, flip-chip, wafer-level packaging (WLP), 2.5D/3D integration, TSVs, silicon interposers, or chiplet-based solutions.
  • Knowledge of industry qualification and reliability standards, including JEDEC and AEC-Q100.
  • Experience working with customers, OSATs, and external technology partners.
  • Experience supporting Technology Development and Technology Qualifications.
  • PMP certification or equivalent project management qualification.
  • Experience working in a global semiconductor manufacturing environment.

Responsibilities

  • Lead end-to-end CPI qualification projects supporting Technology Development Programs, including defining strategies, scope, deliverables, milestones, and success criteria.
  • Develop and maintain project plans, schedules, budgets, resource forecasts, and risk mitigation strategies.
  • Coordinate and lead cross-functional teams across Technology Development, Design, Reliability Engineering, Manufacturing, Quality, Supply Chain, and external partners.
  • Support the selection and management of outsourced semiconductor assembly and test (OSAT) partners.
  • Drive test vehicle planning, design definition, and qualification vehicle implementation.
  • Define reliability qualification plans, test structures, characterization requirements, and data collection strategies.
  • Track project progress, qualification metrics, reliability results, budgets, and schedules.
  • Proactively identify, assess, and mitigate project risks, technical challenges, and schedule impacts.
  • Lead technical and program reviews, facilitate cross-functional decision-making, and ensure alignment on qualification strategies.
  • Drive milestone readiness assessments and lead qualification reviews to support technology and product release decisions.
  • Support customer engagements by communicating qualification strategies, project status, reliability results, and technology readiness.
  • Prepare and present project updates, technical recommendations, risk assessments, and executive summaries.
  • Establish effective communication and collaboration across global teams and partner organizations.
  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Benefits

  • Equal opportunity in the workplace
  • Attraction and retention of highly qualified people
  • Reasonable accommodation for employment process
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