To further strengthen our Chip-to-Package Interaction (CPI) team, we are seeking an experienced and highly motivated Senior Qualification Project Manager with a strong background in semiconductor technology development, project management, post-fab technologies (bumping, assembly, and package-level testing), BEOL integration fundamentals, and reliability qualification methodologies. In this role, you will lead CPI qualification programs from concept through qualification and technology release, working closely with global, cross-functional teams including technology development, design, reliability engineering, manufacturing, and external assembly and test partners (OSATs). You will play a key role in enabling next-generation semiconductor packaging solutions and advanced technology platforms. The position is based at GlobalFoundries' facility in Malta, New York.
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Job Type
Full-time
Career Level
Senior