Senior Project Leader

Luminus, Inc.•Sunnyvale, CA

5d•$165,000 - $180,000

About The Position

Luminus Devices is an established, fast-growing, and profitable pioneer in the development and manufacturing high-power LED solutions for automotive, medical, and industrial applications. Recognized as a global leader in color quality, human-centric lighting, and power density, we are architecting the future of specialty lighting. Headquartered in Silicon Valley and is backed by the world-leading resources of San’an Optoelectronics, we are seeking a visionary Product Development Engineer to drive innovation in semiconductor packaging and process technology. We are looking for a Project Leader with experience in managing high power LED’s or semiconductors development projects for the Medical, Life Sciences and Industrial market.

Requirements

Master’s or PhD degree in Engineering, Physics, Materials Science, or a related technical field.
Minimum 10 years of experience in semiconductor product development; specialized experience in the automotive or medical sector is highly desirable.
Deep expertise in optoelectronic device package design and the development of manufacturing processes.
Ability to influence cross-functional team members towards project goals.
Good verbal and written communication skills; ability to present ideas and project status is a must.
Ability to analyze data and identify trends, which requires a fundamental understanding of LED physics and device characteristics.
Highly motivated individual and good team player with “whatever it takes” attitude and a proven track record of pushing ambitious projects toward timely and successful market entry.
Ability to travel internationally on a need basis. (Less than 10%)

Nice To Haves

Experience working with overseas CM’s is a plus, as is the ability to communicate in Mandarin.

Responsibilities

Drive innovation in high-power LED package development for Medical, Life Sciences, and Industrial applications.
Execute Product Development activities such as scheduling project resources, planning tasks and following up with stakeholders’ deliverables.
Lead the design and validation of optimized chip and package structures through close collaboration with technology teams in China and HQ.
Execute hands-on Design of Experiments (DOE) and rigorous optical performance testing to validate and refine breakthrough designs.
Integrate Design for Manufacturability (DFM) and risk analysis (DFMEA/PFMEA) to ensure new packaging materials and processes are robust and scalable.
Manage multiple projects and track progress as a program manager. Prepare and present development status at phase exit meetings.
Actively generate intellectual property and collaborate with patent attorneys to secure the company’s technological advancements.