Senior Product Engineer (Adv Pkg Pathfinding), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM)

Micron Technology • Boise, ID

1d • Onsite

About The Position

As a member of the HIG HBM Package Product Engineering team, you will lead and develop a high-performing team driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will work with a distributed team of professional Product Engineers leading a portfolio of outstanding Next Generation HBM Products. These products prioritize Quality, Cost, Cycle Time, and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually improving the efficiency of the HIG HBM PE organization.

Requirements

• Bachelors/Masters/Ph.D. in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or related field
• Proven track record in semiconductor industry
• Deep knowledge of sophisticated package process/integration and DRAM or other memory.
• Excellent data extraction, analysis and reporting skills (JMP or other tools)
• Proficient communication in English, with good presentation skills.

Nice To Haves

• Familiar with memory's testing methodology.
• Dedicated and highly motivated with a flexible approach towards adapting to different roles in a multifaceted working environment (from owning the team to leading technical programs).
• Strong record of collaborative work within/across teams to address sophisticated business and engineering problems.

Responsibilities

• Collaborate with Advanced Package Technology team to enable sophisticated interconnect technology solutions that include wafer to wafer bonding.
• Work with Test Solutions team to enable the tests solutions, providing analysis of yield and electrical characteristics data.
• Work with engineering teams on electrical failure analysis and develop DFT and characteristic data for sophisticated packaging solutions.
• Work on EFA of sophisticated packaging failure, and extract and provide electrical and mechanical characteristics data.
• Actively mentor and develop team members to nurture growth and development within the team and the organization.
• Work closely with various multi-functional teams, including Sophisticated Packaging, Build, Test Solution teams, Yield Engineering to ensure the multidisciplinary development and successful enablement.
• Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
• The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: Ph.D. or professional degree
• Number of Employees: 5,001-10,000 employees