Micron Technology is a world leader in innovating memory and storage solutions. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory, taking ideas from early experiments to factory-ready processes, working hands-on with materials, tools, and partners across the industry. This role is a senior Process Engineering Technical Leader focused on chip-to-wafer and hybrid bonding. The leader will lead the development and scale-up of bonding processes that enable high-performance 3D memory products like HBM and 3DS DRAM. The work will span early pathfinding through high-volume manufacturing, with a clear impact on reliability, performance, and cost.
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Job Type
Full-time
Career Level
Senior
Number of Employees
5,001-10,000 employees