Senior Process Engineering Technical Leader

Micron TechnologyBoise, ID
Onsite

About The Position

Micron Technology is a world leader in innovating memory and storage solutions, aiming to transform how the world uses information to enrich life for all. The Advanced Packaging Technology Development team is dedicated to pushing the boundaries of 3D memory, taking ideas from early experiments to factory-ready processes through hands-on work with materials, tools, and industry partners. This Senior Process Engineering Technical Leader role is focused on chip-to-wafer and hybrid bonding. The successful candidate will lead the development and scale-up of bonding processes that enable high-performance 3D memory products such as HBM and 3DS DRAM. The work will span from early pathfinding through high-volume manufacturing, with a clear impact on reliability, performance, and cost.

Requirements

  • Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field
  • 13+ years of semiconductor R&D experience, including 10+ years in advanced packaging
  • Proven ability to lead multi‑team technical efforts and drive decisions without formal authority

Nice To Haves

  • Experience leading FOAK process or equipment development under technical uncertainty
  • Hands‑on work with equipment and materials suppliers shaping next‑generation capabilities
  • Demonstrated technical leadership through mentoring, methodology development, patents, or publications
  • Deep expertise in bonding processes such as solder reflow, TCB, and hybrid bonding
  • Strong understanding of process and package integration and cross‑module interactions

Responsibilities

  • Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs
  • Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs
  • Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions
  • Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs
  • Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness

Benefits

  • Choice of medical, dental and vision plans in all locations
  • Benefit programs that help protect your income if you are unable to work due to illness or injury
  • Paid family leave
  • Robust paid time-off program
  • Paid holidays
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