Micron Technology is a world leader in innovating memory and storage solutions, aiming to transform how the world uses information to enrich life for all. The Advanced Packaging Technology Development team is dedicated to pushing the boundaries of 3D memory, taking ideas from early experiments to factory-ready processes through hands-on work with materials, tools, and industry partners. This Senior Process Engineering Technical Leader role is focused on chip-to-wafer and hybrid bonding. The successful candidate will lead the development and scale-up of bonding processes that enable high-performance 3D memory products such as HBM and 3DS DRAM. The work will span from early pathfinding through high-volume manufacturing, with a clear impact on reliability, performance, and cost.
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Job Type
Full-time
Career Level
Senior