Senior Principal Semiconductor Tech Lead Engineer

RTX•Andover, MA

3d•Onsite

About The Position

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. Raytheon has an exciting opportunity for a Senior Principal Semiconductor Technical Lead Engineer to join our III-V process development team within the Microelectronics/Module Design & Foundry Services Department. In this role, you will work on cutting-edge gallium arsenide, gallium nitride-based devices, and III-V focal plane array fabrication. We are seeking a highly skilled professional with a broad understanding of microelectronics processing, III-V device characteristics, reliability requirements, MMIC product performance, and failure analysis. As a Sr. Principal Semiconductor Technical Lead Engineer, you will collaborate across all of engineering work centers in our III-V semiconductor wafer foundry to manage projects in process development, transition to production, yield improvement, and process sustainment. You will provide subject matter expertise from semiconductor fabrication perspective on reliability data, failure analysis, DC & RF test methods, MMIC performance, foundry layout, and design rules. You will also monitor progress, report on milestones, and drive foundry improvements. The ideal candidate is an innovative problem-solver with a demonstrated ability to think critically and creatively, both independently and in team settings. A strong background in microelectronics processing techniques, such as data analysis, foundry process integration, and process characterization, is essential. Excellent verbal and written communication skills are key attributes when briefing leadership and driving execution amongst the team. The candidate is expected to work well in large and small, cross-functional teams, understand foundry processes, develop process improvements, establish root cause of yield drivers, drive implementation of solutions for MMIC product yield drivers and reliability failures, identify opportunities for future semiconductor processes, gather sponsorship and team resources, and execute activities.

Requirements

Typically requires a Bachelor’s Degree in Science, Technology, Engineering or Mathematics (STEM)
A minimum 10 (ten) years’ of prior work experience or an Advanced Degree in a related field and minimum 5 (five) years’ of prior work experience in semiconductor processing techniques including photolithography, dry etching, wet chemistry, metals evaporation, sputtering and backside processing and also knowledge of III-V device characteristics and MMIC performance.
The ability to obtain and maintain a U.S. government issued security clearance post-start is required.
U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.

Nice To Haves

Experience managing and reporting on project schedules and financials.
Proven ability to lead cross-functional teams and execute improvement initiatives.
Excellent communication and coordination skills to work effectively with stakeholders.
Familiarity with III-V semiconductor fabrication processes and techniques.
Strong analytical and data-driven approach to problem-solving.
Proficient in statistical process control and lean manufacturing methods (e.g., Six Sigma).
Experience in a data analysis software package (e.g., SQL, JMP).

Responsibilities

Lead, manage, and support both independent and contract research and development projects.
Develop process development and yield improvement ideas followed by collaboration with Advanced Technology program team throughout the capture, proposal, award and execution phases of development programs.
Provide subject matter expertise of major yield drivers in the semiconductor foundry and serve as the technical interface with programs on MMIC yield loss and product failures at the next higher-level assembly.
Develop a semiconductor technology roadmap to identify and implement next-generation process technologies, process improvements, product yield enhancements, and identify gaps in equipment capabilities.
Drive transition to production initiatives of semiconductor technologies and process modules while bridging the gap between process development and MMIC product sustainment.
Create and maintain schedules for process development and yield improvement initiatives to drive execution of projects on time and within budget.
Effectively communicate with senior leadership, program management and customer community on engineering project status and root cause investigations.
Engage the MMIC and module design teams to develop semiconductor processes that enable product performance.
Collaborate with cross-functional teams to understand semiconductor process interaction with MMIC performance and reliability to identify process limitations and areas for improvement.
Manage engineering investments and improvement initiatives to achieve program cost and schedule, support capacity and technology roadmap objectives.