Senior Principal Process Engineer Lead

BAE Systems • Austin, TX

22h • $132,962 - $226,035 • Onsite

About The Position

This role is responsible for developing, optimizing, and sustaining manufacturing processes including solder paste screen printing, solder paste inspection (SPI), pick-and-place assembly, reflow soldering, automated optical inspection (AOI), X-ray inspection, chip bonding processes.

The Senior Principal Process Engineer will be the SME (subject matter expert) and lead process capability improvements, equipment qualification, statistical process control (SPC) implementation, and manufacturing readiness efforts while supporting New Product Introductions (NPI) and Non-Recurring Engineering (NRE) builds. The position requires strong collaboration with Operations, Quality, Maintenance, Supply Chain, and Program Management teams.
This is a FT onsite position on a 9/80 work schedule with every other Friday off.

Requirements

• Bachelor’s degree in engineering (Manufacturing, Mechanical, Electrical, or related field)
• 8+ years of experience in electronics manufacturing or advanced assembly processes
• Strong experience with Surface Mount Technology (SMT) manufacturing processes and Circuit Card Assembly (CCA)
• Must be able to obtain a secret clearance

Nice To Haves

• 10+ years of experience in electronics manufacturing or advanced assembly processes
• Strong experience with Surface Mount Technology (SMT) manufacturing processes and Circuit Card Assembly (CCA). Experience leading high performing teams.

Responsibilities

• Provide technical leadership and ownership of SMT and advanced microelectronics assembly processes including screen printing, SPI, pick-and-place, reflow, AOI, AXI/X-ray, chip bonding, and underfill processes.
• Develop, optimize, and sustain manufacturing process parameters to ensure high reliability, repeatability, and process capability for aerospace and defense electronics.
• Lead process troubleshooting and root cause analysis for manufacturing defects using structured problem-solving methodologies.
• Implement and maintain Statistical Process Control (SPC) monitoring across critical manufacturing processes to ensure process stability and early detection of variation.
• Support New Product Introduction (NPI) activities including design for manufacturability (DFM) reviews, process development, prototype builds, and production readiness validation.
• Provide engineering support for Non-Recurring Engineering (NRE) builds, including prototype and engineering development builds, new process development, and early manufacturing risk mitigation.
• Lead equipment qualification and process validation activities including installation qualification (IQ), operational qualification (OQ), and performance qualification (PQ).
• Develop and maintain manufacturing documentation, including process specifications, PQP’s, validation reports, and engineering procedures.
• Drive continuous improvement initiatives focused on yield improvement, defect reduction, and manufacturing efficiency.
• Generate Basis of Estimates (BOEs).
• Partner with Quality Engineering to ensure compliance with AS9100 quality management requirements and IPC standards.
• Collaborate with Maintenance and Operations teams to improve equipment performance, reliability, and production throughput.
• Provide technical mentorship and guidance to process engineers and technicians.
• Participate in cross-functional reviews with program management, design engineering, and manufacturing teams to support production readiness and manufacturing risk reduction.
• Ensure compliance with safety requirements including LOTO procedures, Job Safety Analysis (JSA), and environmental health and safety standards.
• Support manufacturing readiness for high-reliability aerospace and defense programs.
• Provide technical ownership and oversight of critical assembly processes including: Solder Paste Screen Printing Solder Paste Inspection (SPI) Pick and Place Assembly (Fuji) Reflow Soldering Automated Optical Inspection (AOI) Automated X-ray Inspection (AXI) Chip Bonding / Die Attach Underfill dispensing and curing processes
• Lead continuous improvement initiatives
• Improve process capability (Cp/Cpk)
• Increase manufacturing yield
• Reduce defects and process variation
• Improve equipment performance and utilization
• Lead validation activities including: Equipment, installation and qualification Reflow thermal profiling Inspection program optimization Equipment capability studies
• Ensure compliance with IPC standards and AS9100 quality requirements.
• Develop and implement SPC strategies to monitor critical process parameters such as: solder paste deposition placement accuracy reflow temperature profiles inspection defect trends

Benefits

• health, dental, and vision insurance
• health savings accounts
• a 401(k) savings plan
• disability coverage
• life and accident insurance
• employee assistance program
• a legal plan
• discounts on things like home, auto, and pet insurance
• paid time off
• paid holidays
• paid parental, military, bereavement, and any applicable federal and state sick leave
• Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards
• Other incentives may be available based on position level and/or job specifics.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Number of Employees: 5,001-10,000 employees