Senior Principal Engineer, Hardware Application Engineering — Board & System Design

Marvell TechnologySanta Clara, CA
$177,820 - $266,400

About The Position

As Senior Principal Engineer for Board & System Hardware Design, you will be the senior technical authority guiding customer hardware design-in on Marvell's Ethernet Switch and UALink platforms, and a key technical bridge between Marvell's silicon teams, internal hardware engineering, and the field. Your primary mission is to ensure that customers' next-generation switches, AI fabric platforms, and networking systems are designed right the first time — performant, manufacturable, reliable, and ready for high-volume production. This is a deep individual contributor role with a strong system-design and productization focus. You will spend most of your time reviewing and shaping customer hardware designs — covering board architecture, PCB stack-up and material selection, power architecture, thermal design, mechanical integration, and reliability and retain full hands-on capability across the entire design lifecycle from architecture through schematic, layout guidance, and bring-up. You will also play a central role in defining and supporting reference designs for new silicon and serving as a trusted technical educator to both customers and internal teams. You will be a key technical voice in Marvell's evolution toward 224G and 448G SerDes-class systems and the emerging open AI fabric standards.

Requirements

  • PhD, Master's, or Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field.
  • 15+ years of experience in hardware design, development, and validation of high-speed networking or compute systems.
  • 7+ years of dedicated experience in board and system design for high-speed platforms involving modern SerDes (25G NRZ through 112G/224G PAM4).
  • Proven full-lifecycle ownership of complex high-speed boards: architecture, schematic, layout guidance, and bring-up.
  • Demonstrated experience defining and delivering reference designs that enabled customer or internal platform adoption.
  • Strong expertise in PCB stack-up design and material selection for high-speed, high-layer-count boards.
  • Deep experience with power architecture for high-current ASICs, including PDN design, sequencing, decoupling, and tolerance analysis.
  • Solid background in thermal design and mechanical integration for high-power network and AI systems.
  • Working knowledge of SI/PI principles, with the ability to review customer simulations and run targeted simulations independently when needed.
  • Hands-on experience with hardware bring-up, lab debug, and root-cause analysis using industry-standard lab equipment.
  • Deep understanding of high-speed interfaces: Ethernet, PCIe, DDR, advanced SerDes, and modern power delivery architectures.
  • Strong grasp of design for reliability, manufacturability, and testability across the product lifecycle.
  • Customer-facing experience supporting complex technical engagements and resolving real-world deployment issues.
  • Proven ability to develop and deliver technical training content to engineering audiences.
  • Excellent communication skills, with the ability to influence senior customer engineering teams and collaborate across disciplines and geographies.

Nice To Haves

  • Direct experience with Ethernet switch platforms (any tier) and/or emerging open AI fabric standards and architectures.
  • Experience designing or reviewing platforms targeting megascale data center deployments.
  • Background in reference platform design and customer enablement for silicon-based solutions.
  • Familiarity with ODM/CM manufacturing flows, including DFM/DFT, qualification, and reliability testing.
  • Experience with advanced cooling approaches (liquid, immersion) for high-power AI/networking platforms.
  • EDA tool fluency in either Cadence (Allegro/Sigrity) or Mentor/Siemens (Xpedition/HyperLynx) ecosystems — tool-agnostic candidates with deep expertise welcome.
  • Track record of influencing silicon and platform roadmaps based on customer and field insights.

Responsibilities

  • Serve as the senior technical advisor to customer hardware teams designing platforms around Marvell's Ethernet switches and UALink silicon, from early architecture through production ramp.
  • Lead design-in reviews of customer schematics, PCB stack-ups, and overall system architectures, identifying risks early and guiding customers to best-in-class implementations.
  • Define, develop, and support reference designs for new Marvell silicon — partnering with silicon, packaging, and internal HW engineering teams from early product definition through customer release.
  • Work closely with Marvell's internal hardware engineering and silicon teams as a feedback channel from the field — influencing silicon I/O, package, power, and reference design choices based on real customer deployment learnings.
  • Drive PCB stack-up strategy and material selection (low-loss laminates, copper roughness, glass weave, via construction) to meet high-speed performance and cost targets.
  • Own architecture, schematic, layout guidance, and bring-up of Marvell reference and evaluation platforms, applying full lifecycle hands-on expertise where needed.
  • Guide customers on power delivery architecture, including PDN design, multi-rail sequencing, decoupling strategy, and tolerance analysis for high-current ASICs.
  • Advise on thermal design, mechanical integration, and cooling strategies (air, liquid, immersion) to meet performance and reliability targets in real deployments.
  • Provide guidance on signal and power integrity, reviewing customer SI/PI simulations and contributing simulations directly when the project requires it.
  • Drive design for reliability, manufacturability, and testability — ensuring smooth transitions to production at ODM/CM partners.
  • Develop and deliver technical training to customers and internal Marvell teams covering Marvell silicon, reference designs, high-speed design best practices, and productization methodologies.
  • Provide technical leadership on 112G and 224G PAM4 SerDes designs today, and help shape Marvell's hardware approach for next-generation 448G systems.
  • Lead hardware bring-up support, root-cause debug, and issue resolution during customer lab phases and early production.
  • Partner closely with Marvell Silicon Design, Packaging, SI/PI, Software, and Operations teams to deliver fully integrated solutions.
  • Contribute to product definition and roadmap planning by bringing real-world customer feedback into architecture and marketing discussions.
  • Represent Marvell's hardware expertise in customer briefings, executive reviews, and industry technical forums.

Benefits

  • employee stock purchase plan with a 2-year look back
  • family support programs
  • robust mental health resources
  • recognition and service awards
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