About The Position

The Effector Digital Products (EDP) department designs digital electronic circuit cards and electronic units which are supported from proposal through transition to production. Our systems are subject to environments ranging from the frigid, sub-zero vacuum of space to the blistering heat of the desert floor, to the high pressures of the ocean depths. The Digital, RF and Power Team is seeking a Sr Principal Digital Design Engineer with digital electronics design and analysis skills to join our team. This position is 100% ONSITE in Tucson, Arizona. We are looking for candidates willing to collaborate, innovate, and team with our engineers to generate and utilize today’s cutting-edge technology to design digital electronics circuits that implement missile guidance, video and digital signal processing. Our technology base includes high-speed digital electronics, configurable logic, and homogeneous / heterogeneous multiprocessor designs. The Sr Principal Digital Design Engineer is responsible for the design, analysis, simulation, test, and integration of digital electronic modules and/or CCAs for Missile applications.

Requirements

  • Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 10 years of prior relevant experience.
  • Minimum of 10 years of engineering digital circuit design experience.
  • Experience with PCB design process and expertise in tools used to design (schematic capture), analyze and simulate designs prior to hardware execution.
  • Active and transferable U.S. government issued security clearance is required prior to start date.
  • U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.

Nice To Haves

  • Master’s degree in Electrical Engineering.
  • Experience using Mentor Graphics Design Creation (Siemens EDA) tools: DxDesigner, xDX Designer VX, and Xilinx (Zynq Ultrascale, Vivado, Atrix).
  • Experience with embedded test techniques, design for test, design margin analysis and design for production for complex circuit card assemblies between 16 and 32 layers.
  • Experience using PCB electronic circuit design software: HyperLynx signal integrity, power integrity, and analog simulation, Xpedition Enterprise (xPCB).
  • Experience with FPGA code development or software.
  • Team and project leadership skills.
  • A strong advocate for process improvement.
  • Experience with intellectual property generation (patents & publications).

Responsibilities

  • Design, analysis, simulation, test, and integration of digital electronic modules and/or CCAs for Missile applications.
  • Hardware designs with processors, FPGAs, Memory, and Industry interfaces, such as PCIe, Ethernet, I2C, SPI, and UART.
  • Take a design concept from the block diagram or requirements level to development of a complete hardware design, and verification via test and integration.
  • Functioning in multi-disciplined design teams across multiple projects.
  • Leading a program transition from development to production.
  • Managing technical/schedule risks to identify cost reduction opportunities to meet assigned deadlines.
  • Cost/schedule development and management.

Benefits

  • medical
  • dental
  • vision
  • life insurance
  • short-term disability
  • long-term disability
  • 401(k) match
  • flexible spending accounts
  • flexible work schedules
  • employee assistance program
  • Employee Scholar Program
  • parental leave
  • paid time off
  • holidays
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