Senior / Principal Applications Engineer – Advance Packaged Optics (CPO)

Marvell Technology•Santa Clara, CA

7d•$154,680 - $231,700

About The Position

The CPO Apps team operates at the intersection of optics, high‑speed electrical design, advanced packaging, and system architecture, providing hands‑on technical support and successfully enabling customer adoption of Co‑Packaged Optics at scale. This role involves acting as the primary technical interface for strategic customers designing CPO into GPUs, accelerators, and scale‑up platforms. You will lead customer architecture reviews, design‑in engagements, and deep‑dive technical discussions. The position requires translating system‑level customer requirements into complete CPO solutions spanning optics, electrical, mechanical, and thermal domains, as well as supporting bring‑up, characterization, debug, and qualification of CPO‑based designs. Lab skills are a must. You will provide clear technical guidance, trade‑off analysis, and risk mitigation throughout the customer design cycle. The role also drives end‑to‑end CPO solution definition, including optical engines and silicon photonics integration, high‑speed electrical interfaces (112G+, die‑to‑die, advanced SerDes), signal integrity, power delivery, thermal, and packaging constraints, mechanical integration into GPU or accelerator packages, and support for host system integration, including board‑level, cooling, and manufacturing considerations. Performing hands‑on lab‑level test, characterization, debug, and failure analysis of CPO systems is also a key responsibility, as is being the Technical Demo Lead & Owner for Optical Industry Events.

Requirements

Bachelor’s, Master’s, or PhD in Electrical Engineering, Optical Engineering, Photonics, or related field
10+ years experience in high‑speed interconnects, optics, and/or advanced packaging
High‑level knowledge of Co‑Packaged Optics and deployment in large‑scale compute systems
Deep understanding of: Optical link architectures and budgets, High‑speed SI/PI, GPU/accelerator packaging and integration constraints, CPO test, qualification, and manufacturing considerations
Proven experience supporting customer design‑ins at the system or package level
Strong debugging and lab capability across electrical, optical, and thermal domains
Demonstrated ability to work directly with Tier‑1 customers, lead technical meetings, and drive decisions
Background in silicon photonics, advanced packaging/chiplets, or CPO manufacturing and test

Responsibilities

Act as the primary technical interface for strategic customers designing CPO into GPUs, accelerators, and scale‑up platforms
Lead customer architecture reviews, design‑in engagements, and deep‑dive technical discussions
Translate system‑level customer requirements into complete CPO solutions spanning optics, electrical, mechanical, thermal, and test
Support bring‑up, characterization, debug, and qualification of CPO‑based designs
Provide clear technical guidance, trade‑off analysis, and risk mitigation throughout the customer design cycle
Drive end‑to‑end CPO solution definition, including: Optical engines and silicon photonics integration, High‑speed electrical interfaces (112G+, die‑to‑die, advanced SerDes), Signal integrity, power delivery, thermal, and packaging constraints, Mechanical integration into GPU or accelerator packages
Support host system integration, including board‑level, cooling, and manufacturing considerations
Perform hands‑on lab‑level test, characterization, debug, and failure analysis of CPO systems
Technical Demo Lead & Owner for Optical Industry Events