Senior PIC Architect

OpenLight Photonics•Goleta, CA

12d

About The Position

The Opportunity You will design, implement, and deliver photonics integrated circuits (PICs) with optical gain and lasers in the OpenLight proprietary heterogenous silicon-IIIV photonic platform, for applications including data center communications, LiDAR, optical computing, and sensing. This work is done by working cross-functionally with, and ensuring alignment between, customers, business development, component design, layout, test, and reliability engineers, to deliver PICs that meet expected performance and applications. In other words: You will play a critical role in bringing new products to market.

Requirements

Ph.D. in Electrical Engineering, Applied Material Science, Applied Physics or related discipline
10+ years of relevant work experience (professional and PhD experience combined)
Proven record of working across organization boundaries and driving complex programs to successful completion through collaboration.
In-depth understanding of photonic integrated circuits and their components: lasers, modulators, amplifiers, detectors, passives, and optical coupling.
In-depth knowledge of opto-electronic device requirements for datacom and LiDAR applications.
Strong problem-solving, communication, organizational, interpersonal and presentation skills.

Nice To Haves

Hands-on experience with high-speed optical testing is desirable.
Hands-on experience with packaging is desirable.

Responsibilities

Drive the definition, design, simulation, layout, and test of silicon photonic circuits working with customers and across functional teams within OpenLight.
Work with customers to map their product requirements onto OpenLight proprietary heterogenous silicon-IIIV photonic platform.
Perform initial feasibility studies, define program timelines and deliverables.
Use industry standards and trends to derive requirements for OpenLight reference PIC designs.
Use commercial and custom-built tools to design and model custom PICs.
Present results to customers and internal stakeholders.
Coordinate packaging, chip interface requirements, and fabrication requirements with packaging, layout, and process teams.
Define test requirements, review test plans, and analyze test data.
Identify, specify, and prioritize new components to develop for the PDK roadmap.
Work with component designers to ensure that new components can meet specifications.