Senior Packaging Technical Engineer - Hardware

NVIDIA•Us, CA

About The Position

Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. Our dynamic work environment demands proactive ownership, as you’ll play a key role in driving technology across multiple functions. In this position, you’ll be responsible for crafting and implementing silicon pad rings, as well as working with a variety of package technology types and complex technologies. This is not just another engineering role—it’s a unique opportunity that actively encourages innovative, out-of-the-box problem solvers to contribute and shape the future of our technology.

Requirements

BSEE or equivalent experience.
Minimum of 8+ years in board/system design.
Hardworking and able to work with a minimum of supervision.
Seek to solve complex technical problems.

Nice To Haves

Experience with package design is preferred.
Good understanding of transmission line theory, power delivery and signal integrity is desired.
Programming and scripting skills in Perl, Python, Tcl desired.
Cadence Skill and EXCEL familiarity are useful and a plus.

Responsibilities

Defining and implementing the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
Collaborating with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.
Defining a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package.
Communicating effectively with various teams throughout the company.