Senior Packaging Integration Lead

Astera Labs • San Jose, CA

1d

About The Position

Astera Labs is seeking a Senior Packaging Integration Lead to be the dedicated packaging owner for advanced connectivity products. This role involves managing the entire packaging lifecycle, from understanding customer needs and defining package architecture to overseeing development, qualification, and production. The lead will act as the primary packaging representative to customers, internal teams, business units, and the supply chain (OSAT, foundry, substrate). This is a senior individual contributor role requiring technical leadership to set direction, make critical technology decisions, and influence stakeholders without direct authority. The successful candidate will collaborate with packaging leadership on strategy while owning the technical execution for their assigned products, including defining package architecture and test vehicles to mitigate risks, and guiding engineers and partners to deliver robust, manufacturable packages on schedule.

Requirements

• B.S. or M.S. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a related discipline; advanced degree preferred.
• 5-7+ yrs of experience in advanced packaging technologies such as 2.5D/3D integration, TSV, chiplets, and interposers.
• Demonstrated end-to-end ownership of a product or platform packaging solution, from definition and architecture through qualification and production ramp
• Experience defining package architecture and driving technology selection, including trade-off analysis across performance, cost, reliability, and manufacturability
• Experience defining test vehicles and characterization/qualification strategies to de-risk new packaging technology.
• Direct customer-facing experience translating product and system requirements into package specifications and commitments.
• Strong architecture-level understanding of signal/power integrity (SIPI), thermal, and thermo-mechanical reliability considerations in advanced packages
• Proven ability to lead and influence across internal cross-functional teams, business units, and external OSAT/foundry/substrate partners without direct authority.
• Hands-on background working with foundries, OSATs, substrate suppliers, and material vendors.
• Excellent communication, organizational, and executive-level presentation skills, with the ability to drive alignment across globally distributed teams.

Nice To Haves

• Optical / co-packaged optics experience is a plus.
• Experience with UCIe / die-to-die interconnect and high-bandwidth chiplet integration
• Experience with CoWoS-class, silicon-bridge, or advanced fan-out packaging platforms
• Experience with co-packaged optics / optical packaging for scale-up connectivity
• Track record engaging foundry and OSAT partners on advanced-packaging technology roadmaps

Responsibilities

• Own the packaging solution end-to-end for assigned products — serve as the single point of accountability from a packaging standpoint across definition, development, qualification, and production ramp
• Act as the primary packaging interface to the customer: capture and translate customer packaging, mechanical, thermal, SIPI, and reliability requirements into package architecture, specifications, and a clear execution roadmap
• Define package architecture, structure and technology selection (e.g., 2.5D/3D integration, chiplet/interposer, CoWoS-class, organic substrate) with feasibility, cost, performance, and manufacturability trade-off analysis
• Define and drive test vehicle (TV) strategy and requirements to de-risk new package technology, characterize interconnect/SIPI performance, and validate assembly and reliability ahead of product builds
• Represent packaging across internal cross-functional teams — silicon design, package design, SIPI, thermal, product engineering, test engineering, validation, quality, and operations — and align packaging requirements to product and business-unit roadmaps
• Partner with product planning, architecture, and program management on product roadmap, packaging feasibility, technology readiness, cost targets, and schedule commitments
• Set technical direction with OSAT, foundry & substrate partners — driving technology selection, design-rule alignment, and development roadmaps across the supply base
• Own package definition deliverables and sign-offs, including POR/TOR, design rules, stack-up, package BOM, DFM alignment, and pre-tape-out design-integration readiness
• Drive risk identification, technology-gap closure, and mitigation across the product’s packaging roadmap; escalate and resolve critical cross-functional and supplier issues with urgency.
• Communicate packaging status, risks, and key decisions to executive leadership, customers, and cross-functional stakeholders & external partners.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior