Senior Optomechanical Packaging Engineer

MKS Instruments•Milpitas, CA

3d•$101,675 - $169,475•Onsite

About The Position

As an Optomechanical Packaging Engineer at MKS, you will lead the development of advanced optical and optoelectronic packaging solutions for next-generation photonics and optical communication test systems. The successful candidate will be responsible for the design, integration, automation, and qualification of precision optical assemblies, including photodiodes, fiber-coupled devices, optical receivers, laser sources, and photonic integrated circuits (PICs). Emphasis will be placed on active alignment processes, automated assembly equipment, motion control systems, optical packaging architectures, and long-term product reliability. This role requires a hands-on engineer capable of working across optics, mechanics, electronics, manufacturing, automation, and reliability disciplines to transform laboratory prototypes into scalable production products.

Requirements

BS, MS, or PhD in Mechanical Engineering, Optical Engineering, Physics, Mechatronics, or a related field.
8+ years of experience developing optomechanical or photonic products.
Strong experience in precision optomechanical design.
Hands-on experience with active optical alignment processes.
Experience developing automated manufacturing or assembly systems.
Knowledge of motion control systems and precision positioning technologies.
Experience with tolerance analysis and mechanical design.
Strong understanding of optical packaging challenges and solutions.
Experience supporting products from concept through production release.
Strong laboratory troubleshooting and debugging skills.
Eligible to work in the United States.
Not requiring sponsorship for work visas.

Nice To Haves

Experience packaging photodiodes, lasers, optical receivers, optical transceivers, or photonic integrated circuits (PICs).
Experience with optical communication products.
Experience developing automated active alignment stations.
Experience with machine vision systems and robotic assembly equipment.
Familiarity with fiber-attach and photonic packaging processes.
Experience with epoxy, solder, eutectic, or laser-welding attachment methods.
Experience with reliability qualification standards such as Telcordia, MIL, or IEC.
Familiarity with statistical process control and yield analysis.
Experience working with external packaging houses and manufacturing partners.

Responsibilities

Design precision optomechanical assemblies for fiber optics, photodiodes, laser sources, and photonic integrated circuits.
Develop packaging architectures and optics that optimize optical performance, mechanical stability, thermal performance, manufacturability, reliability, and cost.
Define optical and mechanical tolerances and alignment budgets.
Develop packaging solutions for fiber-to-chip coupling, fiber-to-photodiode coupling, free-space optical systems, laser and detector integration, and multi-channel optical assemblies.
Work closely with optical, electrical, and manufacturing engineers throughout the product lifecycle.
Lead development of active alignment processes for optical and optoelectronic assemblies. Select and integrate piezo stages, nanopositioners, linear motors, servo systems, and precision encoders.
Optimize system accuracy, repeatability, throughput, and robustness.
Support integration of optical metrology and machine vision feedback systems.
Perform failure mode and root-cause analysis.
Define qualification plans including thermal cycling, temperature and humidity testing, mechanical shock and vibration, life testing, and accelerated aging.
Support regulatory and customer qualification activities.
Generate work instructions, assembly procedures, and production documentation.
Support finite element and multi-physics simulations as required.
Model packaging-induced optical performance impacts.
Correlate simulation results with experimental measurements.