Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Applied Materials•Tainan, CA

15d

About The Position

The Senior Member of Technical Staff (Advanced Packaging Pathfinding) is a senior individual contributor responsible for driving pathfinding and early-stage technology development for N+2 and beyond advanced packaging architectures. The role focuses on disruptive innovation, technical problem-solving, and concept-to-feasibility execution to shape future integration solutions and create new value opportunities. It operates at the intersection of technology innovation, customer roadmaps, and ecosystem collaboration, translating emerging concepts into scalable capabilities aligned with Applied Materials’ long-term strategy. The role drives long-range exploration of advanced packaging inflection points, leads hands-on development and feasibility studies, develops and validates integration approaches, and performs technical analysis to inform design, process integration, and technology decisions. It owns technical modules or integration challenges within pathfinding programs and delivers experiments, simulations, test vehicles, models, prototypes, and demonstrations. The position also engages stakeholders to connect customer and system requirements with technical work, collaborates with suppliers and industry partners, contributes to early-stage governance, influences cross-functional priorities, communicates technical recommendations, and mentors junior engineers. The position is based at Science Park II in Singapore and is expected to move to Tampines in December 2026. Travel is 20% of the time, and relocation is eligible.

Requirements

10–15+ years of experience in semiconductor technology, with strong exposure to advanced packaging, process integration, or related domains.
Demonstrated experience in technology development, pathfinding, or exploratory R&D.
Strong understanding of advanced packaging technologies, including RDL, TSV, CoWoS, or hybrid bonding.
Ability to solve complex technical problems and translate concepts into experimental validation.
Strong communication skills to articulate technical insights and business relevance.

Nice To Haves

Advanced degree (MS or PhD) in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related field.
Experience in heterogeneous integration, chiplet architectures, or next-generation interconnect technologies.
Track record of innovation, such as patents, publications, or first-of-a-kind solutions.
Familiarity with design–process co-optimization and system-level trade-offs.

Responsibilities

Drive long-range (N+2 and beyond) pathfinding exploration in advanced packaging, identifying key inflection points in interconnect scaling, materials, and integration architectures.
Lead hands-on development and feasibility studies for novel packaging concepts, including D2W, RDL, CoWoS, TSV, and heterogeneous integration schemes.
Develop and validate new integration approaches, such as mixed interconnect architectures, advanced bumping strategies, and next-generation substrates.
Perform technical analysis and trade-off assessments to guide design, process integration, and technology selection decisions.
Contribute technical insights and benchmarking to make/buy/partner evaluations.
Own key technical modules or integration challenges within pathfinding programs and drive concept-to-demonstration execution.
Design and execute experiments, simulations, and test vehicles to validate ideas and reduce technical risk.
Develop scaling frameworks and design–process co-optimization strategies for future performance, cost, and reliability requirements.
Translate concepts into technical deliverables, including models, prototypes, and demonstration vehicles.
Document and communicate findings to influence technology roadmaps and downstream development programs.
Engage internal and external stakeholders to translate customer requirements and trends in AI, HPC, memory integration, and chiplets into actionable technical problems.
Identify technical challenges and gaps in current packaging approaches and propose solutions.
Contribute to value propositions by connecting technical innovation to performance, cost, and scalability benefits.
Collaborate with materials suppliers, equipment teams, OSATs, foundries, and research partners to co-develop and validate technologies.
Support joint development efforts and early-stage collaborations with technical expertise and insights.
Use ecosystem capabilities to accelerate learning and de-risk new concepts.
Contribute data-driven technical recommendations to early-stage governance and decision frameworks.
Influence cross-functional process, product, and integration teams to align technology direction and development priorities.
Develop executive-ready technical narratives explaining innovation value, risks, and trade-offs.
Mentor junior engineers and help build technical depth and an innovation culture within the team.