Senior Member of Technical Staff, Thin Films Engineer
About The Position
Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a senior technical leader driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, a nd manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements. Your Mission: Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and /or treatment technologies. Operating at the nexus of Technology Development and High - Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes.
Requirements
- Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field
- 8+ years semiconductor industry experience with strong focus on thin film deposition processes
- Proven experience in process development, technical leadership, and manufacturing engineering
- Extensive background working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization
- Comprehensive fab startup experience across manufacturing, quality, R&D, and supply chain functions
- Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems
Nice To Haves
- Doctoral degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologies
- Expertise in Gate All Around (GAA) logic technologies within semiconductor foundry environments
- Proven track record delivering customized solutions across Technology Development and HVM organizations
- Cross-functional leadership experience managing diverse stakeholder groups
- Semiconductor foundry experience
Responsibilities
- Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules
- Drive defectivity reduction and uniformity improvements through systematic process enhancement
- Lead technical problem resolution and deliver solutions that meet aggressive technology node targets
- Optimize equipment performance working with internal teams and key suppliers
- Align technical vision with customer requirements and business objectives
- Synthesize complex technical data to formulate and execute strategic responses
- Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines
- Deliver rapid execution of innovative solutions to meet challenging development timelines
- Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups
- Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers
- Present technical findings effectively to diverse audiences from engineering teams to executive leadership
- Foster in-person collaboration to accelerate decision-making and problem resolution
- Stay current with semiconductor industry trends and emerging process technologies
- Drive strategic initiatives that position Intel at the forefront of manufacturing innovation
- Contribute to technology roadmaps through hands-on technical expertise and market insight
Benefits
- We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
