Senior Member of Technical Staff (CMP) Engineer
About The Position
Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry. MDCE is seeking a Senior Member of Technical Staff (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers.
Requirements
- Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
- 7+ years of experience in semiconductor manufacturing / process development or technology development
- 4+ years of direct experience in Chemical Mechanical Planarization (CMP) process development experience with hands-on process tuning and characterization
- Experience with major CMP equipment platforms in one of the following platforms (AMAT, Ebara, etc.)
- Experience with CMP consumables (e.g. slurries, pads, conditioning disks, filters, clean chemistries)
Nice To Haves
- Doctorate in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
- Experience with advanced technology nodes (e.g. sub-10nm logic, specifically in Gate All Around (GAA) architectures with track record of successful technology development and HVM implementation
- Cross-functional leadership experience, including task force leadership for yield improvement initiatives
- Experience with CMP integration with other process modules (e.g. deposition, lithography, etch, clean) and CMP-relevant metrology with understanding of CMP impact on device performance and yield.
- Experience with CMP-relevant metrology and process control (e.g. thickness, topography, defects, roughness, particles)
- Previous semiconductor foundry experience
Responsibilities
- Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes
- Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield
- Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies
- Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions
- Bridge technology development and manufacturing teams to ensure smooth transition of CMP processes to production
- Drive ongoing optimization initiatives to enhance process capability, yield, and manufacturing efficiency
- Work closely with Integration, Device, Yield, Factory, Quality, and Customer Engineering teams
- Collaborate with equipment and consumables suppliers to co-develop and optimize CMP solutions
- Mentor junior engineers and provide technical guidance across the organization
Benefits
- competitive pay
- stock bonuses
- health
- retirement
- vacation
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What This Job Offers
Job Type
Full-time
Career Level
Senior
