Senior Mechanical Engineer

Hewlett Packard Enterprise•Sunnyvale, CA

6d•$124,000 - $251,000•Onsite

About The Position

Hewlett Packard Enterprise is hiring a hands-on Senior Mechanical Engineer to design, analyze, develop, and qualify complex networking systems from concept through production. Reporting to the Head of Mechanical Engineering, this individual contributor works independently on challenging engineering problems and collaborates with cross-functional teams in a fast-paced product development environment. The role focuses on mechanical design and structural analysis, including finite element analysis (FEA), shock and vibration, and simulation-to-test correlation, while supporting prototype evaluation, laboratory testing, root-cause investigations, and design improvements to ensure product reliability and structural integrity. The engineer will develop and maintain structural FEA capabilities for new product introduction and sustaining projects, improve simulation accuracy through test correlation, and coordinate work across internal functions and external partners. The position also provides design guidance from the concept phase, supports mechanical issue resolution during MDVT and HALT, designs test chassis and fixtures, analyzes test data, and documents simulations and tests for design reviews. Additional work includes ASIC modeling and placement studies, production-yield improvement, chassis and packaging design, hands-on CAD and testing activities, and contributions to specifications, validation plans, design guidelines, project estimates, schedules, and engineering practices. The role is designated onsite, with the expectation that the employee will primarily work from an HPE office. HPE describes benefits supporting physical, financial, and emotional wellbeing, along with personal and professional development programs and an inclusive workplace.

Requirements

At least 7 years of experience in electromechanical product development.
Bachelor of Science in Mechanical Engineering, Applied Physics, or equivalent.
Experience developing networking, server, storage, telecommunications, or high-performance computing systems.
Extensive experience with chassis development, system packaging, and high-density electronic assemblies.
Experience with FEA and familiarity with ANSYS Workbench, including static-structural, modal analysis, transient mode superposition, Eigenvalue-Buckling, and steady-state thermal analysis.
Strong hands-on experience with tolerance analysis, GD&T, stack-up analysis, and structural analysis techniques.
Experience meshing sheet-metal geometries as solid or shell elements and simplifying meshes by defeaturing non-structural elements.
Strong structural intuition regarding load paths in mechanical designs.
Ability to break complex system designs into subsystems to simplify FEA setup and runtime.
Familiarity with test standards including GR-63, IPC-9704, and ASTM D4169.
Strong working knowledge of Young’s modulus and coefficients of thermal expansion of materials commonly used in ASIC and cooling components.
Experience analyzing accelerometer G-value data from dynamic tests such as vibration and shock.
Hands-on experience in dynamic testing.
Extensive experience developing complex chassis and system-level mechanical designs for networking, server, storage, or telecommunications products.
Experience with ECAD-MCAD integration and IDF workflows.
Deep understanding of sheet-metal design, machining, castings, extrusions, plastics, and related manufacturing processes.
Strong understanding of tooling requirements and manufacturing considerations for volume production.
Strong understanding of NEBS, EMI, EMC, safety, and other regulatory compliance requirements.
Ability to troubleshoot complex system-level mechanical issues in laboratory, manufacturing, and field environments.
Experience leading root-cause investigations and implementing corrective actions.
Excellent communication and leadership skills, including the ability to influence cross-functional teams.
Comprehensive understanding of the product development lifecycle from concept through production and field support.

Nice To Haves

SolidWorks experience; expert-level proficiency with 3D solid modeling tools is expected.
Working knowledge of EPDM or an equivalent PLM system.
Experience with LS-Dyna and response spectrum analysis.
Experience modeling die warpage due to thermal effects and heatsink loading.
Training or experience applying strain gauges to PCBs and analyzing principal microstrain and strain rate.
Knowledge of dye-and-pry, Shadowmoire, and operation of 3D-scanning metrology equipment.

Responsibilities

Develop and own structural FEA simulation capabilities for ongoing NPI projects and sustaining issues.
Improve simulation accuracy through test correlation and model refinement.
Maintain and coordinate multiple FEA projects involving personal work, internal functions, and external partners.
Provide concept-phase design guidance by running FEA studies on areas of concern.
Support mechanical issues arising from MDVT and HALT, and lead issue resolution by validating design changes through simulation and/or testing.
Design and prototype chassis and fixtures for testing.
Process and analyze test data, including microstrain, G-levels, and ASIC temperatures, throughout MDVT and HALT.
Document tests and FEA simulations—including static loading, modal analysis, and dynamic analysis—in NPI project design reviews, and take responsibility for system structural integrity.
Communicate recommended design changes to hardware leads with justification supported by FEA results.
Collaborate with ASIC development teams to create 3D ASIC models from package outline drawings, including BGAs, and conduct near-package or co-package connector placement and floorplan studies as needed.
Support manufacturing and operations in improving production yield through FEA studies or limited laboratory design-of-experiments work.
Provide mechanical design and structural analysis support across product development programs, including chassis design, packaging, reliability, and manufacturability.
Participate in hands-on engineering activities, including CAD design and reviews, tolerance analysis, prototyping, testing, and root-cause investigations.
Collaborate with cross-functional teams and suppliers to identify technical risks, resolve design and manufacturing issues, and implement corrective actions.
Contribute to mechanical specifications, design guidelines, validation plans, and engineering best practices.
Provide project scoping, resource estimates, schedule input, and technical guidance for new product development efforts.