About The Position

At RTX, the world's largest aerospace and defense company, 185,000 great minds are united by purpose and inspired to make a difference solving the world’s most complex problems. With our three market leading businesses, world-class operations and investments in research and development, we offer capabilities and opportunity no one else can. Together, we push the boundaries of known science and find new ways to connect and protect our world. Raytheon brings the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. We deliver solutions that help our nation and allies defend freedoms and deter aggression, creating a safer, more secure world. Join us and help shape the future of aerospace and defense. This is an onsite position

Requirements

  • Typically requires a Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 5 years of prior relevant experience.
  • Experience performing design and analysis for the packaging of RF products (e.g. Circuit Card Assemblies, antennas, radomes, RF test equipment, harnesses and interconnects) throughout the product life cycle to include three dimensional (3D) Computer Aided Design (CAD) software
  • Experience with creation of Technical Data Packages (TDPs) using Geometric Dimensioning and Tolerancing (GD&T) for products
  • Ability to obtain a U.S. government issued security clearance is required after the start date

Nice To Haves

  • Master of Science (MS) in mechanical engineering or electrical engineering
  • Experience serving as a Responsible Engineering Authority (REA), Control Account Manager (CAM), and/or Integrated Product Team Lead (IPTL)
  • Supplier management for built to print or build to specification RF products
  • Experience creating and presenting professional level design documentation to company leadership and program customers
  • Creo Simulate or ANSYS Workbench for preliminary structural and thermal analysis of design concepts
  • Excellent written and verbal communication skills
  • Failure investigation, root cause identification, and corrective action implementation
  • Familiarity or direct experience with RF Printed Circuit Board (PCB) material stack ups and Circuit Card Assembly (CCA) layout
  • One dimensional tolerance analysis for complex mechanical assemblies
  • Development of technical proposals, engineering project estimates, and/or white papers
  • Requirements verification test planning and execution

Responsibilities

  • Provide technical oversight and guidance to small work groups.
  • Lead the development of common and mature RF product packaging solutions.
  • Serve as a technical resource and subject‑matter expert across the organization.

Benefits

  • relocation based on candidate eligibility
  • medical
  • dental
  • vision
  • life insurance
  • short-term disability
  • long-term disability
  • 401(k) match
  • flexible spending accounts
  • flexible work schedules
  • employee assistance program
  • Employee Scholar Program
  • parental leave
  • paid time off
  • holidays
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