Senior Mechanical Analyst Engineer

RTX•Goleta, CA

15d•$95,500 - $181,700•Onsite

About The Position

Raytheon seeks an experienced Mechanical Engineering Analyst who will be primarily focused on thermal stress analyses and will also be responsible for dynamic and static structural as well as transient thermal analysis. Analysis will cover a wide range of difficult problems, requiring solutions that are imaginative, thorough, and practical. Analysis will be of complex component and assembly structures using classical and/or advanced methods of analysis to articulate risk for internal and external customers based on data driven models. Your results will drive product design, materials selection, and planning decisions around risk reduction and/or characterization testing. This position is onsite in our Goleta, CA location.

Requirements

Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 5 years of prior relevant experience.
Experience in structural and/or thermal analysis.
Structural testing: planning, organization, execution, data reduction and correlation (e.g. material strength characterization testing).
Experience performing Structural Finite Element Analysis using NASTRAN/PATRAN, ANSYS or equivalent software.

Nice To Haves

Excellent communication skills, especially relating to presentation development and delivery.
Low-temperature materials knowledge.
Knowledge of working with thin structural bonds in assemblies.
Thermal testing: planning, organization, execution, data reduction and correlation.

Responsibilities

Analysis of tasks involving hardware designs for static and dynamic strength, stiffness, fatigue and fracture mechanics as well as linear and non-linear thermoelastic behavior.
Support analysis through all phases of the program life-cycle, from proposal, to conceptual design/requirements derivation, to PDR/CDR, and build/test/delivery and occasional failure analysis or anomaly resolution.
Develop and understanding of structural requirements for infrared and visible imaging sub-systems and related electronics.
Products being developed primarily serve terrestrial or airborne Tactical DoD customer programs or spaceflight instruments.
Perform hand calculations based on fundamental equations.
Ability to travel to government and other facilities in support of program activities.