Senior Embedded Engineering Program Manager

Whoop•Boston, MA

2d•$130,000 - $185,000•Onsite

About The Position

At WHOOP, we're on a mission to unlock human performance. WHOOP empowers members to perform at a higher level through a deeper understanding of their bodies and daily lives. WHOOP is seeking a Senior Embedded Engineering Program Manager to lead the firmware development for new WHOOP devices. In this role, you will partner closely with Firmware, Hardware, Connectivity, Manufacturing, and WHOOPLabs teams to ensure timely delivery of firmware features to unlock novel WHOOP hardware. You will be a vital part of the growing Hardware EPM team, reporting into the Director of Hardware Program Management.

Requirements

Degree in Engineering or equivalent practical experience in firmware development.
5+ years of experience in Technical Program Management, Engineering Program Management, or related roles supporting embedded systems, firmware, or hardware product development.
Experience leading complex embedded projects from concept through production release.
Experience coordinating with hardware engineering, manufacturing, and global external partners.
Strong understanding of embedded systems development, firmware release processes, and hardware-software integration challenges.
Strong organizational, multi-tasking, and time management skills with the ability to thrive in fast-paced, ambiguous environments
Excellent communication and stakeholder management skills, both written and verbal

Nice To Haves

Ability to travel internationally to support engineering builds (up to 5%)

Responsibilities

Own firmware program planning and execution across WHOOP’s NPI portfolio, ensuring alignment between product, engineering, and operational milestones from concept through launch.
Develop and maintain integrated firmware schedules, roadmaps, and dependency tracking across multiple concurrent hardware projects.
Partner with Firmware Engineering Leadership to drive prioritization, capacity planning, risk management, and execution readiness.
Drive firmware milestone planning, including architecture readiness, feature development, integration, validation, manufacturing readiness, user acceptance testing and launch activities.
Collaborate closely with Hardware, Connectivity, Sensor Intelligence, Automated Test Engineering, Manufacturing, and WHOOP Labs teams to identify and manage cross-functional dependencies throughout the product development lifecycle.
Facilitate cross-functional program reviews, status updates, and executive communications, ensuring stakeholders have visibility into progress, risks, and tradeoffs.
Identify schedule, technical, and resource risks early and lead mitigation planning across engineering and operational teams.
Support development and validation efforts for Proto/EVT/DVT/PVT, manufacturing bring-up, and launch readiness activities.
Establish scalable planning processes, tools, and reporting mechanisms to improve predictability and execution across embedded engineering programs.
Partner with engineering leaders to continuously improve development workflows, release planning, and execution efficiency.