Senior Electro-Mechanical Packaging Engineer

PGS Worldwide • Orlando, FL

21h • Onsite

About The Position

PGS Worldwide is seeking a Senior Electro-Mechanical Packaging Engineer in Orlando, Florida, for an approximately six-month onsite contract-to-hire role supporting a leading aerospace and defense company. The position leads advanced microelectronics packaging and electromechanical design activities involving 3D heterogeneous integration, thermal management, structural performance, and high-reliability electronic hardware.

The engineer designs advanced multichip and 3DHI packaging solutions and electromechanical hardware, collaborates on analysis and qualification, investigates hardware failures, and coordinates engineering execution across teams and the product lifecycle. Pay is $93.94 per hour.

Requirements

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field and 11+ years of relevant experience, or 15+ years of related professional experience without a degree.
• Experience with 3D Heterogeneous Integration (3DHI) and advanced electronic packaging.
• Experience with microelectronics design and high-reliability electronic products.
• Proficiency with Creo modeling and electromechanical system design.
• Experience designing high-density circuit cards, cable assemblies, interconnects, or electronic packaging.
• Experience with thermal management, structural integrity, and mechanical survivability of electronic hardware.
• Technical or project leadership experience throughout the engineering and production lifecycle.
• Experience capturing and managing requirements for electromechanical designs.
• Experience working with cross-functional engineering teams across multiple locations.

Nice To Haves

• Master’s degree or PhD in an engineering or related technical field.
• Experience with advanced finite-element or multiphysics analysis.
• Knowledge of JEDEC and MIL-SPEC electronic packaging qualification requirements.
• Experience with earned value management, project scheduling, cost estimating, and technical risk management.

Responsibilities

• Design advanced multichip and 3DHI packaging solutions, including substrates, heat spreaders, stiffeners, attachment mechanisms, and thermal-management systems.
• Develop electromechanical designs for circuit cards, electronic assemblies, harnesses, and related hardware.
• Collaborate with electrical and mechanical analysts on thermal, structural, signal-integrity, and reliability assessments.
• Support packaging qualification and environmental testing activities.
• Investigate hardware failures involving solder joints, delamination, substrate warpage, and other package-interface issues.
• Develop corrective actions and incorporate lessons learned into future product designs.
• Lead design assurance reviews and drive technical issues to closure.
• Coordinate with systems, hardware, software, test, manufacturing, and supply-chain teams.
• Manage technical risk, schedule, cost, and engineering execution for assigned hardware.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior