Electro Mechanical Engineer

The Structures Company•Orlando, FL

14h•Onsite

About The Position

The Electro Mechanical Engineer owns package hardware design, heat transfer, thermal dissipation, structural integrity, and mechanical survivability for completed 3D Heterogeneous Integration (3DHI) packages. The role designs multichip package devices, including package substrates, Integrated Heat Spreaders, attachment mechanisms, stiffeners, and integrated thermal management systems. It develops advanced finite element analysis (FEA) multiphysics models and simulations covering thermal cycling, reliability, power integrity, electrical performance, mechanical stress, shock, and vibration. The engineer defines and executes packaging qualification plans against project requirements, JEDEC standards, and MIL-SPEC standards, including Highly Accelerated Stress Testing and HAST. The role performs failure analysis on component interfaces and intermetallic connections, such as cracked solder joints, delaminated layers, and warped package substrates; implements corrective actions for manufacturing failure modes; and incorporates findings into product revisions and lessons learned. The position also architects, designs, and validates advanced circuit card packages, high-density circuit cards, cable assemblies, and interconnect solutions. It designs electromechanical systems such as printed wiring boards, circuit or electronic card assemblies, harness assemblies, and sub-assemblies, and performs thermal, signal integrity, and electromagnetic compatibility analyses for operation in harsh DoD environments. The engineer leads design assurance reviews, tracks issues, drives corrective actions to closure, and manages risk, schedule, and earned value metrics. This is a five-month contract role with potential for extension, located in Orlando, Florida, paying $93.94 per hour. The candidate must be a U.S. Person under ITAR and able to obtain a security clearance after starting.

Requirements

Must be a U.S. Person as defined by ITAR regulations.
Ability to obtain a security clearance after starting.
Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university, or at least 15 years of professional experience in Electromechanical Engineering or a related discipline without a degree.
At least 11 years of experience with 3D Heterogeneous Integration (3DHI).
At least 11 years of experience with Advanced Packaging.
At least 11 years of technical or project leadership experience supporting production of high-reliability electronics products.
At least 11 years of experience with microelectronics design.
Proficiency in CREO modeling and electromechanical system design.
Project leadership or management experience across the engineering and production lifecycle, including scoping, sizing, cost estimation, planning, scheduling, staffing, tracking, and earned value management (EVM).
Experience working with cross-functional teams across multiple locations.
Experience capturing flowed and derived requirements for electromechanical designs.

Responsibilities

Own package hardware design, heat transfer, thermal dissipation, structural integrity, and mechanical survivability of completed 3DHI packages.
Design multichip package devices, including package substrates, Integrated Heat Spreaders, attachment mechanisms, stiffeners, and thermal management system integration.
Develop advanced FEA multiphysics models and simulations for thermal cycling, reliability, power integrity, electrical performance, mechanical stress, shock, and vibration.
Define and execute packaging qualification plans to project requirements, JEDEC standards, and MIL-SPEC standards, including Highly Accelerated Stress Testing and HAST.
Perform failure analysis on critical component interfaces and intermetallic connections, including cracked solder joints, delaminated layers, and warped package substrates.
Implement corrective actions for manufacturing failure modes and incorporate findings into product revisions and lessons learned.
Architect, design, and validate advanced circuit card packages, high-density circuit cards, cable assemblies, and interconnect solutions.
Design and develop electromechanical systems, including printed wiring boards, circuit or electronic card assemblies, harness assemblies, and sub-assemblies.
Perform thermal, signal integrity, and electromagnetic compatibility analyses for operation in harsh DoD environments.
Lead design assurance reviews, track issues, drive corrective actions to closure, and manage risk, schedule, and earned value metrics.
Lead or manage project work across the engineering and production lifecycle, including scoping, sizing, cost estimation, planning, scheduling, staffing, tracking, and earned value management.