Senior Electrical Engineer

Anduril•Waltham, MA

About The Position

The Space Imaging team develops spaceborne electro-optical/infrared (EO/IR) systems from ideation through initial production. The Senior Electrical Engineer will work with an interdisciplinary technical team to define the electrical architecture of space-qualified EO/IR sensor payloads, build and test prototypes, and mature designs into flight hardware. The role may also lead small engineering teams from concept through system definition and development. The work includes electrical architecture, power electronics, harness and interface design, communications, EMI/EMC and radiation compliance, reliability analysis, integration, and validation. The engineer collaborates with firmware, mechanical, optical, and systems engineers to integrate electrical designs into sensor payload assemblies and verify them against functional and performance requirements.

Requirements

Bachelor's degree in Electrical Engineering or a related technical field is typically required.
8 or more years of experience designing power, interface, or mixed-signal electronics for space, airborne, or other harsh-environment defense systems.
Experience designing isolated DC/DC power conversion, EMI filters, and transient/over-voltage protection circuits for low-voltage DC systems.
Familiarity with MIL-STD-461 and MIL-STD-464, or equivalent EMI/EMC design and test methods.
Experience with connector selection, pin and harness definition, and parts/wire derating analysis, such as per MIL-HDBK-1547A or equivalent.
Strong hardware debugging skills using standard laboratory equipment, including oscilloscopes, multimeters, and logic/protocol analyzers.
Proficiency with schematic capture and circuit simulation tools, and worst-case stress/derating analysis.
US Person status, as the position requires access to export-controlled data.
Eligibility to obtain and maintain an active U.S. Secret security clearance.

Nice To Haves

Experience designing radiation-tolerant electronics and performing TID/SEU analysis for space systems.
Experience with high-speed digital/communication interfaces (10GbE, SERDES) and signal integrity analysis.
Familiarity with machine-vision/sensor communication protocols such as GigE Vision.
Experience with hybrid microelectronics packaging (MIL-PRF-38534) or similar high-reliability component standards.
PCB layout experience using tools such as Altium or Cadence for mixed-signal or RF boards.
Familiarity with EO/IR sensor payload electronics, including detector bias/readout and cryocooler drive electronics.
Familiarity with embedded Linux/firmware interfaces to support electronics bring-up.

Responsibilities

Define and own electrical architecture for EO/IR sensor payload assemblies, including power distribution, connector and harness interfaces, grounding and bonding, and communication interfaces.
Design, analyze, and test isolated power conversion, EMI filtering, inrush current limiting, and over-voltage and reverse-polarity protection for low-voltage DC payload power systems.
Select connectors, define pin assignments, perform wire, cable, and component derating analyses, and establish shielding, bonding, and isolation schemes to meet EMI/EMC requirements.
Design and support high-speed Ethernet (10GbE) and discrete I/O (RS-422, I2C, SPI) interfaces between sensor electronics and host avionics.
Support EMI/EMC qualification testing to MIL-STD-461/464 and design ESD protection.
Select radiation-tolerant components for TID/SEU requirements in space and tactical environments.
Perform EEE parts stress and derating analyses and support hybrid microelectronics selection to ensure reliable operation across mission life.
Collaborate with firmware, mechanical, optical, and systems engineers to integrate electrical designs into sensor payload assemblies, including bring-up and verification testing.
Develop and execute test procedures using laboratory equipment to validate designs against functional and performance requirements.
As needed, lead small teams of engineers from concept through system definition and development.

Benefits

Highly competitive equity grants are included in the majority of full-time offers.
Top-tier benefits for full-time employees, including a comprehensive, competitive benefits package available at little to no cost to employees.

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