Senior Electrical Engineer

Hexmodal Technologies Inc•New York, NY

1d•Onsite

About The Position

We are looking for a Senior Electrical Engineer to join our Hardware Engineering team full-time, in person, in our New York City office. You will own the full lifecycle of IoT product electronics, from system architecture and PCBA design through verification, certification, and high-volume manufacturing. You will work closely with mechanical, firmware, and manufacturing teams to bring connected products from concept to mass production, and you'll be a key voice in resolving field issues and continuously improving product quality. This role reports to our Head of Hardware Engineering.

Requirements

Bachelor's degree in Electrical Engineering or a related field.
8-12+ years of professional experience in electrical/hardware engineering, with significant depth in high-volume IoT product design; consumer, industrial, medical or similar electronics product categories.
Proven experience designing wireless, battery-operated IoT devices including battery selection and power consumption optimization.
Proven experience designing AC mains-powered electronic devices.
Strong understanding of digital and sub-1GHz RF circuit design in conjunction with MCUs.
Hands-on experience with common embedded communication interfaces: UART, SPI, I2C, DCMI, and others.
Experience selecting and integrating sensors (e.g., temperature, humidity, pressure, strain, image, ambient light, time-of-flight) into electronic product designs.
Experience with electromechanical integration of PCBAs into mechanical housings.
Experience with design for test (DFT) in a high-volume electronics manufacturing environment.
Strong rapid-prototyping skills, including soldering and hands-on use of multimeters and oscilloscopes.
Experience leading or supporting regulatory compliance testing and certification programs.
Experience developing and executing verification and validation (V&V) test plans.
Experience owning RMA and field-return processes, including root cause analysis and driving corrective design or manufacturing changes.
Experience with product life cycle management and revision control of electromechanical products.

Nice To Haves

Experience with LoRaWAN-based products or networks.
Familiarity with the STM32 MCU family.
Working knowledge of firmware development, with the ability to collaborate closely with firmware engineers on hardware/firmware co-design.

Responsibilities

Own system architecture and circuit design for IoT products, including both battery-operated wireless devices and AC mains-powered devices.
Design and develop PCBAs incorporating MCUs, digital circuitry, and sub-1GHz RF circuits, along with standard communication interfaces such as UART, SPI, I2C, DCMI, and others.
Select and integrate sensors, including temperature, humidity, pressure, strain, image, ambient light, and time-of-flight sensors, into product designs, from datasheet evaluation through circuit implementation and calibration.
Drive design for manufacturing (DFM) and design for test (DFT) practices to ensure products are optimized for a high-volume electronics manufacturing line.
Lead verification and validation (V&V) testing across electrical, functional, environmental, and reliability domains.
Manage regulatory compliance testing and certification efforts (e.g., FCC, CE, UL, IC, and related wireless/EMC standards).
Perform rapid prototyping and hands-on bring-up/debug, including soldering, and the use of multimeters, oscilloscopes, and other lab equipment.
Partner with mechanical engineering on the electromechanical integration of PCBAs into mechanical housings and enclosures.
Collaborate closely with firmware engineering on hardware/firmware interface definition, board bring-up, and debug.
Support new product introduction (NPI) and work directly with contract manufacturers and test operators to bring designs to volume production.
Own the RMA process for products returned from the field, leading root cause analysis to isolate design, component, and manufacturing-related failures.
Translate root cause findings into corrective actions, driving design changes and manufacturing process updates to resolve field defects and prevent recurrence.