Senior Director, Advanced Packaging Disruptive Technology

Applied Materials • Covington, GA

7d • $200,000 - $275,000 • Hybrid

About The Position

The Senior Director, Principal MTS is a senior technical leader responsible for defining and driving panel scaling technology strategy and customer-facing execution across next-generation advanced packaging and substrate platforms. This role leads cross-functional alignment to accelerate panel-level form factor scaling, RDL scaling, and ecosystem readiness—connecting customer needs to integrated equipment/process solutions and strategic partnerships. This position operates at the intersection of technology roadmaps, account strategy, and disruptive pathfinding, translating panel scaling inflections into executable customer engagements, demo programs, and internal investment priorities.

Requirements

• 15+ years experience in semiconductor packaging, substrates, panel processing, lithography/patterning, deposition/etch, or adjacent advanced manufacturing domains.
• Demonstrated leadership in technology strategy + customer execution (principal-level account leadership, platform adoption, or roadmap ownership).
• Strong working knowledge of advanced packaging drivers: panel form factor scaling, RDL scaling, TGV/glass & organic substrate trends, and manufacturing/yield constraints at large format.
• Proven ability to lead cross-functional organizations and influence without direct authority across engineering, product teams, and external partners.
• Executive communication strength: translating complex technical tradeoffs into business outcomes and decisions.

Nice To Haves

• PhD/MS in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or equivalent experience.
• Prior experience launching new platforms (e.g., panel-based process modules, integrated packaging lines, or disruptive substrate architectures.
• Demonstrated track record of ecosystem building (materials, substrate suppliers, research institutes, foundries/OSATs)

Responsibilities

• Own the panel scaling technology roadmap across form factor scaling, interconnect scaling, and substrate scaling, including transitions from wafer-based approaches to panel-based architectures.
• Define technology inflections and integration milestones for advanced panel build-up and align internal roadmaps to customer adoption cycle.
• Build and manage a partner ecosystem spanning substrate makers, material suppliers, OSATs, foundries, and research institutes to close panel scaling gaps (design rules, warpage, overlay, defectivity, metrology/inspection, reliability).
• Identify, evaluate, and activate disruptive partners and collaborations to accelerate panel readiness and strengthen differentiation.
• Lead executive-ready storytelling and decision frameworks.
• Drive internal alignment across engineering, product lines, marketing, and finance on portfolio gaps and priorities required to lead in advanced panel packaging.
• Resolves exceptionally complex field process issues utilizing systematic troubleshooting methodology generally involving multiple processes. Create a mechanism to communicate issues, track progress and pull resources from multiple divisions and/or functions.
• Uses sound statistical techniques like and problem solving methodologies DOEs (Design of Experiment) to quickly determine root cause and action plans. Communicates learnings from this portion to rest-of-world to strengthen the product packages.
• Serves as the customer expert across a broad range of exceptionally complex products. Plays a key role in defining product strategy and identifying gaps. Provides feedback to division heads on process and hardware improvements to meet customer roadmap requirements.
• Directs the positioning of new technologies to customers utilizing technical information from divisions. Interfaces with customers at key development and manufacturing sites to form strategic partnerships to evaluate new and emerging technologies and oversees joint development activities or beta-site testing programs. Makes senior executive level presentations.
• Keeps abreast of new developments in own and related technology groups. Participates in publishing in ET conferences and journals.

Benefits

• Supportive work culture that encourages you to learn, develop, and grow your career
• Comprehensive benefits package
• Participation in a bonus and a stock award program, as applicable
• Equal Opportunity Employer

What This Job Offers

• Job Type: Full-time
• Career Level: Senior