Senior Assembly Development Engineer

Coherent Corp. Vietnam•Fremont, CA

10h•$91,625 - $150,000•Onsite

About The Position

As the Senior Process Development Engineer, you will lead all aspects of development engineering, work with contract manufacturers, for our high-power CW lasers and their packages. This position demands a hands-on approach to product performance, yield optimization, and production troubleshooting. Your expertise will guide the seamless integration of new products into existing systems and ensure our continued leadership in the market.

Requirements

A Master’s degree or higher in Applied Physics, Materials Science, Electrical Engineering or related field.
At minimum 5 years’ of industrial experience in engineering development, preferably with a focus on semiconductor lasers or related optoelectronic devices such as photodiodes, semiconductor lasers and other devices with InP based materials.
Proficient in data analysis and statistical evaluation related to product engineering.
Exceptional leadership and interpersonal skills, capable of managing complex projects and diverse teams.
Strong problem-solving skills with a proactive approach to addressing and preempting issues.
Excellent communication skills, essential for effective teamwork and cross-disciplinary collaboration.

Nice To Haves

Direct hands-on experience in semiconductor chip packaging is highly desired.
Willingness to travel frequently to manufacturing sites.

Responsibilities

Oversee the entire engineering development effort on chip-on-carrier assembly and/or package/module development for high-power CW lasers, high speed PD, and/or co-packaged optics, ensuring optimal performance and yield.
Work closely with manufacturing teams and Fremont product engineering and logistic team to address needs and optimize performance with contract manufacturers.
Collaborate with Fremont Product Engineers, Design, Planning, Logistic team to ensure good quality product on time delivery on schedule.
Utilize statistical methods to analyze reliability and test data, identifying trends and potential issues to improve product yield and quality; Perform thermal or thermomechanical modeling and analysis during the chip bonding process.