At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today. When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world. Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential. Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you. As a Senior Applications Engineer with a focus on Design Enablement, you will be a key enabler of the next generation of AI infrastructure. You will support customers designing high-speed optical interconnects that power massive GPU clusters and hyperscale data centers. This role is critical for the industry's expanded focus on Pluggable Optics as well as transition to advanced Co-Packaged Optics (CPO), which are essential for connectivity in AI Data Centers. In this role, you will act as the main technical bridge between ST’s foundry customers designing EIC and PIC components for 1.6T, 3.2T and higher data rate optical engines using ST’s Silicon Photonics, SiGe BiCMOS , Advanced Packaging and other related process technologies. The candidate will collaborate with customers’ design and operations teams along with ST’s internal marketing, sales, business unit, foundry and central R&D teams. This is an excellent opportunity for engineers with background and experience in design of RF, photonic IC(s) or image sensors to make an impact in a customer-facing and highly visible facing role.
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Job Type
Full-time
Career Level
Senior