Senior Advanced Packaging/MEMS Process Engineer

Draper•St. Petersburg, FL

6d•$82,300 - $220,000•Onsite

About The Position

Draper is an independent, nonprofit research and development company headquartered in Cambridge, MA. The 2,000+ employees of Draper tackle important national challenges with a promise of delivering successful and usable solutions. From military defense and space exploration to biomedical engineering, lives often depend on the solutions we provide. Our multidisciplinary teams of engineers and scientists work in a collaborative environment that inspires the cross-fertilization of ideas necessary for true innovation. As a Senior Advanced Packaging/MEMS Process Engineer you'll apply advanced semiconductor and microelectromechanical systems (MEMS) process engineering knowledge, theory, and methods to research, design, develop, and qualify processes for Heterogeneous System Integration Package (HSIP) and Fan-Out Wafer-Level (FOWL) technologies. You'll interact with integration, assembly, quality, and equipment engineering teams to drive high-mix | low-volume manufacturing readiness for 2.5D/3D chiplet integration.

Requirements

Bachelor's degree in Electrical Engineering, Mechanical Engineering, or Physics required.
5-10 years of Microsystems Engineering or related experience.
Excellent verbal and written communication skills.
Excellent organizational skills and attention to detail.
Excellent time management skills with the proven ability to meet deadlines.
Strong analytical and problem-solving skills.
Proficient with the fabrication and metrology tools and instrumentation related to MEMS component fabrication.
Proficient with software tools and systems used for device design, modelling, and performance testing.
Proficient with software tools and systems used for statistical process control, and reliability and failure analysis, including yield improvement.
Applicants selected for this position will be required to obtain and maintain a U.S. Security Clearance.

Nice To Haves

Master's degree preferred

Responsibilities

Support end-to-end copper electroplating process development to achieve HMLV yield and reliability targets.
Define copper etch process optimization for fine-line patterning and DBI pre-bond surface preparation.
Optimize and maintain processes like: Wet and Dry etch tools, Vacuum/Sputter systems, Metrology tools.
Work with cross functional teams to develop new processes for new business, make process improvements, troubleshoot issues, and maintain process uptime.
Shares performance experience and operating characteristics with designers or other engineers for new product development purposes and/or training.
Designs and develops Microelectromechanical devices/sensors, schematics and physical layouts of integrated MEMS components or packaged assemblies.
Assesses performance and process capabilities of potential MEMS device designs using modeling or simulation software.
Tests and evaluates devices using a variety of tools, protocols, and software.
Analyzes and addresses issues such as reliability, yield improvement, and/or failure.
Develops production methods and fabrication processes for MEMS.
Drafts documentation such as operating instructions, performance specifications, and manuals.
Develop and maintain effective internal/external relationships.
Drive solutions to complex problems with limited direction, contribute to requirements development, propose ways forward, and adapt appropriately to changes in requirements.
Able to provide insight and suggest design or process modifications based on quantitative data or results.
Identify program/system-level technical risks and develop and execute mitigation strategies for them.
Actively mentor less experienced engineers and provide thoughtful, constructive feedback.
Performs other related duties as assigned.