Semiconductor Packaging Engineer

Analog Devices•Wilmington, MA

3d•Onsite

About The Position

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. About the Role As a Senior Systems Semiconductor Packaging Engineer, you will lead the development of advanced semiconductor packaging solutions for MEMS sensors used in automotive, industrial, medical, aerospace, and defense applications. You will work across the product lifecycle, from concept through manufacturing readiness, helping translate product and customer requirements into robust, scalable packaging solutions. This role calls for strong technical judgment, cross-functional collaboration, and hands-on problem solving. You will partner closely with teams across applications, quality, reliability, manufacturing, and external vendors to improve package performance, manufacturability, and time to market.

Requirements

Strong experience in semiconductor packaging and manufacturing processes, with the ability to support package development from concept through release
Strong understanding of substrates, adhesives, underfills, mold compounds, and interconnect materials used in semiconductor packaging
Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization
Hands-on experience with 3D CAD and engineering analysis tools such as SolidWorks and ANSYS
Demonstrated ability to apply DOE, PFMEA, SPC, 8D, RCA, and related methods to solve technical and manufacturing challenges
Ability to work effectively across applications, manufacturing, quality, reliability, and external partner teams
Strong communication skills with the ability to translate technical issues and requirements clearly across stakeholders

Nice To Haves

Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field
5+ years of relevant experience in semiconductor packaging, process development, or manufacturing engineering
Experience supporting MEMS, sensor, or advanced package development is a plus
Experience working with OSAT partners and external manufacturing vendors is preferred

Responsibilities

Lead project-level semiconductor packaging design activities from product conception through manufacturing readiness
Drive design for manufacturability and design for reliability through process characterization, risk assessment, and structured problem solving
Partner with quality and reliability teams to perform root cause analysis, improve yield, and implement corrective and preventive actions
Perform detailed package analysis using 3D CAD tools such as SolidWorks and simulation tools such as ANSYS to evaluate mechanical and process performance
Apply engineering methodologies including control plans, PFMEA, DOE, SPC, 8D, and RCA to improve product and process outcomes
Partner with Applications Engineering to translate customer specifications into clear technical direction for internal development teams
Work with OSAT partners to support rapid prototyping, early builds, and preliminary qualification activities
Help reduce time to market by aligning package designs with vendor assembly capabilities and manufacturing constraints
Collaborate with multidisciplinary teams to support execution, issue resolution, and product success across development phases