Sr Principal Semiconductor Equipment Engineer

Northrop Grumman•Apopka, FL

2d•$122,800 - $184,200•Onsite

About The Position

Northrop Grumman Mission Systems is looking for a Sr. Principal Semiconductor Equipment Engineer for their Advanced Packaging Technology Fab based in Apopka, Florida. Northrop Grumman’s semiconductor foundry and packaging lines have unique capabilities of supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and providing leading edge technology development. The wafer bumping line will support flip chips, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs. The line will provide a range of bump compositions, including tin/lead, lead-free, microbumps, and copper pillar, using sputter, electro and electro-less plating, and solder-sphere transfer to support flip chips, 2.5D, and 3D packaging. The Semiconductor Equipment Engineer will lead and manage engineering projects such as equipment layout, cleanroom construction and installation of semiconductor equipment along with the daily, weekly, bi-weekly, quarterly, semiyearly and year equipment maintenance. Responsibilities include all aspects of facilities and factory layout for foundry equipment. The chosen candidate will develop and apply continuous improvement programs and be responsible for all aspects of project management including working with and direction of contractors/sub-contractors along with alignment with management. May be responsible for running a group or groups of tools, from day-to-day maintenance/preventative maintenance operations (i.e. chemical management) up to and including service contracts with vendors. Minimal travel - one to three short trips per year.

Requirements

A bachelor’s degree in related STEM field with a minimum of 8 years of relevant work experience; OR a master’s in a related STEM field with 6 or more years of relevant work experience.
A minimum of 6 years of experience working with semiconductor fabrication equipment or the construction industry.
Experience with semiconductor wafer fabrication facilities and operation.
Experience with fab facility, equipment installation, and maintenance.
Experience with Computerized Maintenance Management System.
Ability to obtain and maintain a Secret clearance.
US Citizenship required.

Nice To Haves

Demonstrated ability to work with cross organizational teams such as engineering, line maintenance and building maintenance.
Strong leadership and communication skills.
Experience with semiconductor equipment.
Experience with semiconductor clean room design and construction.
Experience with Architecture and Engineering (“A&E”) drawing sets.
Experience with AutoCAD design.
Experience managing strategic projects from inception through completion; including financial, risk and schedule management.
Experience in low volume/high product mix environments.
Experience interfacing with vendors for equipment repairs, service contracts, and purchase preferred.
Active Secret clearance.

Responsibilities

Lead and manage engineering projects such as equipment layout, cleanroom construction and installation of semiconductor equipment.
Perform daily, weekly, bi-weekly, quarterly, semi-yearly, and yearly equipment maintenance.
Manage all aspects of facilities and factory layout for foundry equipment.
Develop and apply continuous improvement programs.
Manage all aspects of project management, including working with and directing contractors/sub-contractors and aligning with management.
Run a group or groups of tools, from day-to-day maintenance/preventative maintenance operations to service contracts with vendors.