Section Manager - Diffusion #1522

TSMC•Phoenix, AZ

4d•Onsite

About The Position

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future. As a Section Manager – Diffusion, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation, and Customer Trust. Multiple positions available.

Requirements

Bachelor’s degree or foreign equivalent in Electronics, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field, plus 7 years of progressive, postbaccalaureate experience in an engineering role.
Alternatively, company will accept a Master’s degree or foreign equivalent in Electronics, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field and 5 years of experience in an engineering role.
5 years of experience with semiconductor manufacturing principles, practices, and techniques as they relate to equipment engineering and maintenance.
4 years of experience with 5nm technology or beyond in logic chip semiconductor industry.
3 years of experience overseeing junior engineers.
3 years of experience in at least two of the following: mechanical systems knowledge, with a focus on semiconductor lithography track equipment robotics, pneumatics, and electrical systems; physics and chemistry principles as they apply to semiconductor lithography processes; and troubleshooting complex defect and hardware issues to resolve root cause issues.

Responsibilities

Solve critical equipment issues, improving tool uptime availability and utilization efficiency.
Implement best known methods in hardware to control tools performance and utilization.
Identify and pursue opportunities for hardware capability enhancement, driving defect reduction.
Lead the team to complete the establishment of the production line.
Communicate with cross-function engineers or vendors, and serve as a module liaison with facilities, vendor, and manufacturing shift personnel.