R&D Tech Specialist

Keysight Technologies, Inc.•Santa Rosa, CA

3d•Onsite

About The Position

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~16,800 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that in this role, you will play a critical part in ensuring that cutting-edge technologies meet the demanding performance, quality, and lifetime expectations of Keysight customers. You will collaborate closely with device engineers, process technologists, product designers, and manufacturing teams to evaluate, qualify, and continuously improve the technologies that form the foundation of Keysight's product leadership. If you are excited by advanced semiconductor technology, data-driven problem solving, and the challenge of ensuring reliability in products operating at the leading edge of performance, this role offers an opportunity to make a visible and lasting impact. This role is ideal for technicians who enjoy combining hands-on laboratory work, advanced analytical instrumentation, materials characterization, and data-driven problem solving to support breakthrough semiconductor technologies. You will have the opportunity to work with state-of-the-art failure analysis and characterization tools while helping engineers understand device behavior, identify root causes, and accelerate the development of next-generation technologies.

Requirements

Highly motivated technician who enjoys working with advanced analytical equipment and helping engineers solve challenging semiconductor and materials-related problems.
Background in materials characterization, microscopy, semiconductor technology, or laboratory analysis who enjoy hands-on technical work and developing expertise across a variety of analytical techniques.
Hands-on laboratory skills, technical aptitude, attention to detail, and strong organizational abilities.
Familiarity with microscopy techniques, image interpretation, and defect analysis.
Experience collecting, documenting, and organizing technical data in a laboratory or manufacturing environment.
Ability to safely and effectively handle delicate devices and small components requiring excellent fine motor skills and attention to detail.
Proficiency in Microsoft Excel and other tools used for data collection, summary, and reporting.
Strong observational and troubleshooting skills, with the ability to recognize process issues, equipment anomalies, or unusual failure signatures.
Ability to follow established procedures while also identifying opportunities for process improvement.
Excellent organizational skills, including maintaining clear records, test logs, and analysis reports.
Effective communication and interpersonal skills that enable productive interaction with engineers, technicians, operators, and cross-functional teams.
A high level of ownership, accountability, initiative, and self-motivation.
Ability to manage multiple priorities in a fast-paced R&D and laboratory environment.
Must be a U.S. citizen or lawful permanent resident of the U.S., or protected individual, having authorization from the U.S. government for export-controlled items under 8 U.S.C. 1324b(a)(3).

Nice To Haves

Educational or industry background in Materials Science, microscopy, failure analysis, or semiconductor processing, including an Associate’s Degree or similar credential.
Hands-on operation of Scanning Electron Microscopy (SEM) systems for inspection, imaging, and characterization.
Fundamental knowledge of Energy Dispersive X-Ray Spectroscopy (EDX/EDS) and elemental analysis techniques.
Experience operating or supporting Focused Ion Beam (FIB) systems, including cross-sectioning, sample preparation, or imaging.
Experience with Atomic Force Microscopy (AFM) operation and interpretation of topography data.
Experience preparing and handling semiconductor wafers, die, packages, or coupons.
Familiarity with White Light Interferometry (WLI), laser microscopy, X-ray, or other non-destructive imaging systems and surface metrology techniques.
Familiarity with semiconductor fabrication processes, thin-film deposition, etching, lithography, packaging, or assembly operations.
Experience working in cleanroom, laboratory, or semiconductor manufacturing environments.
Basic understanding of optics, electron optics, lenses, vacuum systems, and material properties relevant to analytical instrumentation.
Strong hands-on expertise across multiple analytical platforms, including SEM, EDX, FIB, AFM, X-ray, and optical metrology systems.
The ability to generate high-quality analytical results while maintaining excellent sample handling and preparation practices.
A natural curiosity about how devices, materials, and structures fail and a passion for uncovering root causes.
Experience supporting engineers in complex reliability, process development, and failure analysis investigations.
An eye for detail and a talent for recognizing subtle defects, process excursions, and unusual material behaviors.
The ability to connect analytical observations with materials, processing, and reliability challenges to accelerate engineering problem-solving.
A desire to continuously learn new characterization techniques and contribute to the growth of an advanced semiconductor failure analysis laboratory.

Responsibilities

Support engineering teams by performing failure analysis and material characterization on advanced semiconductor devices, packages, interposers, and related technologies.
Assist engineers and operators with advanced SEM, FIB, and EDX analysis requests, generating high-quality imaging, compositional analysis, and cross-sectional data.
Perform adhesion characterization using stud-pull testing, scratch testing, and other mechanical evaluation techniques.
Run AFM topography measurements and surface characterization studies to support process development and failure investigations.
Conduct non-destructive inspection of devices, packages, and assemblies using X-ray, laser, and white-light interferometry imaging systems.
Document findings, summarize data, and communicate results to engineers and project teams in a clear and organized manner.
Support laboratory organization, equipment upkeep, method development, and continuous improvement initiatives that enhance failure analysis capabilities.