Quantum Interposer Design Engineer

Intel•Hillsboro, OR

12d•Onsite

About The Position

Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing.

Requirements

M.S. degree in Electrical Engineering AND 5+ years of experience in physical design of silicon testchips, interposers, and/or related hardware.
OR Ph.D. degree in Electrical Engineering with academic or work experience in the related areas.
Cadence Virtuoso
Understanding of how signal and power integrity (SI/PI) impacts physical design.
Understanding of advanced packaging technologies.

Nice To Haves

Strong understanding of superconducting metals.
Proven experience with Synopsys and Ansys software packages for APR (automated place and route).

Responsibilities

Physical design and integration of interposers used within advanced packaging for quantum computing
Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers
Design validation and verification; including DRC and LVS
Deliver and disseminate design milestones to stakeholders
Communicate designs in presentations and relevant documentation
Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers