Interposer System Design Analyst & Integration Engineer

HRL Laboratories•Malibu, CA

1d•$172,900 - $221,600

About The Position

The Interposer System Design Analyst & Integration Engineer will develop, model, and validate the thermal and mechanical behavior of superconducting interposer systems operating in deep cryogenic environments in support of HRL’s silicon spin quantum computing efforts. This role involves developing metrology and verification plans and techniques for ensuring these components meet target requirements. The position requires expertise in computational modeling, hands-on manufacturing experience, and cross-functional coordination to ensure robust system-level performance from millikelvin to 4 K. The ideal candidate will possess strong proficiency with FEM tools, cryogenic material modeling, and CAD-based model creation, along with excellent communication skills and the ability to translate complex analyses into clear recommendations.

Requirements

BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, Physics, or a related field with 5+ years of relevant experience.
Expertise with thermal and mechanical FEM modeling tools (e.g., ANSYS, COMSOL, Abaqus) and the ability to design and execute complex simulations.
Extensive hands-on experience with mechanical or thermal test methods, including fixture design, instrumentation, and interpretation of low temperature measurements.
Familiarity with CAD tools used to construct detailed 3D models and simulation geometries.
Deep understanding of materials used in superconducting interposers, including silicon, glass, and metal-based structures.
Experience modeling material behavior at very low temperatures and addressing the challenges associated with deep cryogenic simulations (mK–4 K).
Strong communication skills, with the ability to present modeling assumptions, results, and recommendations to senior stakeholders as well as collaborating effectively with engineering partners.
Strong analytical and problem solving skills, including the ability to reconcile measured data with simulation outputs.
US Person Status Required

Responsibilities

Develop and execute detailed thermal and mechanical finite element models to evaluate the behavior of superconducting interposers and associated packaging structures across cryogenic temperature ranges.
Build complex geometric and material models using CAD tools; generate mesh strategies, boundary conditions, and multi-physics simulations appropriate for deep cryo operation.
Collaborate with teams performing relevant thermal and mechanical measurements to validate FEM predictions, characterize material responses, and identify discrepancies between modeled and measured behavior.
Analyze superconducting interposer materials—including silicon based, glass based, and hybrid architectures—to determine stress distributions, thermal gradients, and deformation behaviors at very low temperatures.
Work collaboratively with process, packaging, and device engineering teams to ensure system level design choices align with cryogenic performance requirements and manufacturing constraints.
Document simulation methodologies, material models, assumptions, and validation results while contributing to design reviews and cross-functional integration discussions.
Communicate technical findings, risks, and design implications clearly to senior management and collaborate with team members to drive data informed engineering decisions.
Support development of cryogenic reliability strategies, including interface behavior, material compatibility, and failure mode mitigation informed by modeling outcomes.