Quality Inspector - Microelectronics - 2nd Shift

BAE Systems•Nashua, NH

3d•$40,003 - $64,006•Onsite

About The Position

In this Quality Inspection I role, you will perform In-Process and Final Inspection operations on microwave modules utilizing a microscope for the majority of the workday. Using predetermined methods, operations, setups and prescribed specifications to visually inspect moderate to complex assemblies and subassemblies to ensure compliance to applicable quality specifications and standards. Work from blueprints, diagrams, regulatory and BAE specifications, drawing or inspection instructions and checklists. You will receive intense training to become a certified inspector utilizing MIL-STD-883 criteria to inspect microwave modules. Microwave elements include MMICs, resistors, diodes, caps, substrates and all bonding types (gold wire and ribbon), which are inspected in accordance with MIL-STD-883.

Requirements

High School Degree or GED equivalent
Previous experience working under general supervision
Effective verbal and written communication skills
English literacy is required to ensure the candidate will be capable of following instructions and safety guidelines.

Nice To Haves

Capable of utilizing a microscope for the majority of the working shift
General knowledge of microelectronics devices
General knowledge of electronics manufacturing.

Responsibilities

Perform In-Process and Final Inspection operations on microwave modules utilizing a microscope for the majority of the workday.
Visually inspect moderate to complex assemblies and subassemblies to ensure compliance to applicable quality specifications and standards using predetermined methods, operations, setups and prescribed specifications.
Work from blueprints, diagrams, regulatory and BAE specifications, drawing or inspection instructions and checklists.
Receive intense training to become a certified inspector utilizing MIL-STD-883 criteria to inspect microwave modules.
Inspect microwave elements including MMICs, resistors, diodes, caps, substrates and all bonding types (gold wire and ribbon) in accordance with MIL-STD-883.