Associate or Senior Product Yield Enhancement Development Failure Analysis Engineer (High Bandwidth Memory)

Micron Technology • Boise, ID

22d • Onsite

About The Position

Micron Technology is seeking a Level 2 or 3 HBM (High Bandwidth Memory) Product Yield Enhancement PDFA Engineer. This role is part of the Product Development Failure Analysis team and focuses on bringing next-generation HBM devices from design to mass production. The team's objective is to ensure product reliability, accelerate time-to-market, and enable rapid production ramp by identifying and resolving component-level failures during new product introduction phases. The engineer will apply electrical, physical, and statistical failure analysis techniques to characterize failures, identify root causes, and drive corrective actions. Collaboration with multi-functional engineering teams and the leverage of advanced analytics, statistical methods, and AI-enabled tools are key aspects of this role to improve failure detection, yield, reliability, and overall product performance.

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related field.
• 2+ years of experience performing electrical and statistical failure analysis to identify and understand failure mechanisms.
• 2+ years of experience applying electrical and physical characterization techniques for semiconductor failure analysis.
• Demonstrated analytical and problem-solving skills, including the application of statistical methods and tools for data analysis.
• Experience using AI, machine learning, or data analytics tools to support engineering analysis and root cause investigations.
• Coursework, training, or practical experience in one or more of the following areas: VLSI, semiconductor device physics, semiconductor processing, Python programming, and statistics.
• Strong written and verbal communication skills with the ability to collaborate effectively in multi-functional engineering teams.

Nice To Haves

• 5+ years of experience performing electrical and statistical failure analysis in the semiconductor industry.
• 5+ years of experience applying electrical and physical characterization techniques for semiconductor device and component analysis.
• Advanced coursework or hands-on experience in VLSI design, semiconductor processes, device physics, Python, and applied statistics.
• Experience using Artificial Intelligence or Generative AI tools (e.g., Copilot, Claude) for large-scale data analysis, failure prediction, and root cause identification.
• Experience using statistical analysis software such as JMP.
• Confirmed ability to influence technical outcomes and drive issue resolution in a multidisciplinary engineering environment.
• Proven ability to communicate complex technical findings to diverse team members and lead multi-functional collaboration efforts.

Responsibilities

• Perform electrical, physical, and statistical failure analysis to identify, characterize, and understand defect and failure mechanisms in HBM products.
• Analyze component- and system-level data to resolve root causes of failures using statistical techniques, engineering methodologies, and AI-enabled tools.
• Apply AI tools (e.g., Copilot, Claude) and improved analytics to enhance failure detection, reliability learning cycles, yield improvement, and component performance.
• Work closely with Product, Process, Test, Quality, and Manufacturing Engineering teams to resolve fabrication, assembly, and test-related issues.
• Identify process defects, assembly-related failures, and test flow marginalities through detailed data analysis and characterization.
• Communicate technical findings, recommendations, and corrective actions to team members and drive issue resolution across multi-functional teams.
• Support rapid production ramp, product qualification, and continuous reliability improvement initiatives.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level