Product Engineer, NPI

Pure Storage•Santa Clara, CA

1d•Onsite

About The Position

As a Product Engineer specializing in PCBA Manufacturing and DFM, you will drive the end-to-end design manufacturability, quality, and production readiness of next-generation printed circuit board assemblies powering high-performance server and storage systems. Partnering cross-functionally with Hardware Design, Mechanical Engineering, Test Engineering, and global Contract Manufacturers, you will establish high-yield manufacturing processes, optimize complex stack-ups, and safeguard signal integrity across critical data center hardware. In this high-impact role, your expertise directly ensures our hardware scales seamlessly from early design through full-volume production with industry-leading reliability.

Requirements

Expertise in PCB Fabrication & Stack-up Design: Mastery of PCB materials, dielectric properties, laminate systems, high-layer-count stack-ups, controlled impedance, and transmission-line behavior (including TDR and S-parameter analysis) for high-speed digital architecture.
Comprehensive SMT & PCBA Manufacturing Skills: Deep technical knowledge of surface-mount technology (SMT) assembly, solder paste printing, reflow profile optimization, pick-and-place process tuning, selective soldering, and IPC standards compliance for high-reliability electronics.
Advanced DFX & CAD Data Analysis: Expertise reviewing Gerber files, drill data, CAM tools, and manufacturing drawings to implement actionable Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Testability (DFT) improvements.
Data-Driven Quality & Inspection Mastery: Hands-on proficiency with process characterization tools including SPI, AOI, X-ray, ICT, test-point strategies, and statistical process control to identify root causes and drive continuous yield improvement.
Cross-Functional & Supplier Leadership: Proven ability to partner effectively with cross-functional hardware teams, test engineers, and global Contract Manufacturers (CMs) to lead pilot builds, qualify suppliers, and resolve complex production challenges.

Responsibilities

PCB Architecture & Fabrication Optimization: Direct PCB material selection, multilayer stack-up design, dielectric properties, and fabrication requirements in partnership with hardware designers and fabrication suppliers to maximize signal integrity, ensure impedance control, and eliminate manufacturability risks before release.
SMT & Assembly Process Qualification: Define, optimize, and qualify SMT and mixed-technology assembly processes—including solder paste printing, component placement, reflow, and selective soldering—collaborating with Contract Manufacturers to achieve first-pass yield targets and robust solder joint integrity.
Advanced Defect Screening & Testability Engineering: Drive production readiness and defect elimination by deploying and calibrating automated inspection and test strategies (SPI, AOI, X-ray, ICT, and functional test) with test engineering teams, ensuring comprehensive probe access, boundary scan coverage, and rapid root-cause isolation.
DFX Reviews & BOM management (Via PLM Tool): Lead comprehensive Gerber, fabrication drawing, assembly, test interaction and BOM reviews in PLM tools to mitigate design risks, optimize assembly hierarchies, and accelerate successful NPI transitions to high-volume manufacturing. Structure and maintain accurate BOMs in tools such as Agile, including part relationships, revisions, assembly and manufacturing data.